Design007 Magazine
Design007-Apr2022
Issue link:
https://iconnect007.uberflip.com/i/1464168
Contents of this Issue
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Articles in this issue
Design007 Magazine — Additive Design
Feature Contents — Additive Design: The Same, but Different
Additional Contents
Flex007 Contents
Column — Additive Design: The Same, but Different
Feature Interview — Additive Design: Same Steps, Different Order
Short — It's Only Common Sense: How to Develop Great Leaders
Feature Article — Designing Additive and Semi-Additive PCBs
Feature Article — Additive Manufacturing Requires Additive Design Techniques
Short — Trouble in Your Tank: Additive, Semi-Additive and Subtractive Fabrication
Feature Article — Designing PCBs With Additive Traces
Feature Column — Burning Questions About Designing for SAP
Short — All Systems Go!: Find and Fix Thermal PCB Problems Sooner Than Later
Column — Leaning into Lean Manufacturing
Book Review — The Printed Circuit Designer's Guide to… Stackups: The Design within the Design
Feature Column — Designing for the SAP Fabrication Process
Feature Column — The Digital Transformation of Advanced Additive Electronics
Column — Using Touchstone Files to Build Measurement Confidence
Feature Interview — Calumet on Additive and Semi-Additive Design
Short — Boeing, AWS Join Forces to Transform Aerospace Design and Manufacturing
Column — The Importance of Circuit Features for Millimeter-Wave Applications
Short — Happy's Tech Talk: Semi-Additive Processes and Heterogeneous Integration
PCB007 Highlights
Column — Design for Test, Part 3
Column — Mandatory Masking Guidelines
MilAero007 Highlights
Column — Turn Down the Heat, Go Green on Resins
Short — Helping the World Build Electronics Better
Article — DFM 101: Solder Mask and Legend
Flex007 Column — The Fascinating History of Wearable Electronics
Flex007 Short — Fresh PCB Concepts: The Right Board for the Flex Job
Flex007 Highlights
Top Ten Editor's Picks
Career Opportunities section
I-007e Educational Resource Center
Advertiser Index and Masthead
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