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JUNE 2022 I DESIGN007 MAGAZINE 61 with electrical continuity and microsection analysis. rough the development phases of A-SAP, we have used the technology on all traditional and many non-traditional substrates with suc- cess, as well as fabricating all traditional PCB features with passing reliability. e A-SAP process is a proven and tested additive fabrication method to achieve next generation technological advancements. Dunn: Switching gears just a bit, you and I have spoken many times about the importance of designing with manufacturing rather than for manufacturing. In fact, this is a direct quote from a video we worked on together quite a while ago: "The use of this innovative and transfor- mative manufacturing method requires a new approach to design: with manufactur- ing instead of for manufacturing. Together, the designer and manufacturer can develop a collaborative approach, to "Drop the SWAP," while increasing the reliability and robustness of the PCB for next-generation electronics systems." I oen hear you impress on people that col- laboration is critical to utilize the full potential of the A-SAP technology. How do you facili- tate this high-quality communication, and what is your advice for designers who want all the advantages of A-SAP capabilities? LaBeau: When utilizing a transformative man- ufacturing process, one must fully understand its advantages as it applies to both design and the product requirements. With a market- changing technology, the manufacturer and designer must work in collaboration to gain all the benefits—while not increasing the cost. e Averatek process allows a designer to simplify designs by using finer traces and spaces, greater line width control, and imped- ance control. If the designer understands this, you can re-set the technology curve: simplify- ing designs to make the process and end-prod- uct more reliable and robust, while reducing risks of lead time or yield delays. e most important takeaway is this: col- laboration between the designer and manufac- turer is critical and must happen to fully utilize this technology and create the intended ben- efits. As we transition from a subtractive to a semi-additive approach, there are new rules that we must apply, at times understanding that not all IPC-6012 standards work for fine lines, especially wrap plating, plating thickness and others. When an innovative technology comes forth, we must design and test, then adapt new standards, which are currently in the works. is design with manufacturing is key to the success and will open avenues to design and manufacture some of the most advanced tech- nologies for all our customers. Dunn: Not only has Calumet Electronics invested in Averatek's A-SAP process, but you have also been actively investing in equipment, new materials, and a facilities expansion. As the CTO, I am sure that keeps you extremely busy. What other technologies do you have in development that the electronics community will be excited about? LaBeau: Calumet Electronics is driving to solve the next generation for unrivaled electronics systems, which includes utilizing Averatek's A-SAP, sintering technologies, and build-ups films. We are excited about the future, with a strong R&D and engineering team. Dunn: Meredith, thanks for taking time for this short interview. LaBeau: ank you, Tara. DESIGN007 Tara Dunn is the vice president of marketing and business development for Averatek. To read past columns or contact Dunn, click here.