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94 PCB007 MAGAZINE I JULY 2022 Technical Requirements e key component to this imaginative pro- cess is the induction welding heads. Figure 5 shows three different designs for such induc- tion heating systems. e ability to change the energy and pressure on the coupons is impor- tant as materials and constructions change. As multilayers of rigid, flex, and rigid-flex change and become more complex, these welding heads also will probably change. Weld Coupons e weld coupons on the perimeter of the inner layer cores replace the old punched or drilled holes. e coupons are varied, but in the range of six to 10 mm wide by 15 to 40 mm long copper and recommended copper clear- ance. All have solid copper decals as seen in Figure 6. Each equipment supplier has much more detail available from the many years they have been supplying systems. Conclusion As Figure 7 illustrates (a complex 32-layer multilayer), the optical alignment process with the welding of all the cores together improves the registration in multilayer lamina- tion. Coupled with the time savings for layup and the cleanup of epoxy around pin plates, pinless lamination can be a great productiv- ity and qual ity improvement. is is shown Figure 4: The induction welding process (coupled induction weld heads) and the resulting temperature profile on weld coupons. (Source: DIS Technologies 2 ) Figure 5: Various induction welding heads. (Source: DIS, InduBond, and CEDAL product brochures)