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68 PCB007 MAGAZINE I SEPTEMBER 2022 In other studies, copper paste was used as a filling material for through-silicon vias (TSV), through-glass vias (TGV), and organic sub- strates. Non-through-holes with diameters of 10-60 mm and depths of 90-150 mm formed in the substrate surface layer were filled with the Cu paste, as well as through-holes with diam- eters of 30-300 mm for Si and glass, and 140- 3000 mm for the organic substrates. All the pastes were sintered, and the results are seen in Table 3 4 . e process is seen in Figure 3 using a vacuum frame and press plate to fill the vias.