Issue link: https://iconnect007.uberflip.com/i/1484263
26 PCB007 MAGAZINE I NOVEMBER 2022 have the circuits on hand yet, but I'm pretty sure we will have it within the year. We plan to grow through the next year and have a capacity that will sat- isfy most of our customers. It depends on which level we can reach. Below 50 microns is still not a common capability, but among those who are professional in HDI, they are down to 40-micron track capability. Some are even more aggressive and can do down to 35. Matties: What is most important to share with today's fabricators from this conversation? Pedersen: ere is a big need and it's grow- ing. We will never go back again. at has never happened. Also, when you see the global recession that is basically happening now, it won't affect the electronics industry and the new developments much because there will always be a big need for these emerging technologies. Matties: Right. Pedersen: We have seen this in electronics through other recessions. Yes, maybe there is a slowdown, but with new technologies, you will always see a need. ere are a lot of things happening that are affecting us. e war in Ukraine, for example, is affecting energy and electricity prices. We will probably see some companies bankrupt because of it. You also see the movement of China around Taiwan, which is not helping. But it's important to be encour- aging about the future of technology. Matties: Do you think the electronics industry will survive all this? Pedersen: I think so. Not all of it, but those who invest in UHDI at these levels will sur- produced 25-micron track and gap beautifully. ey will be able to produce within the end of the year. is was based on the subcontracted processes they're currently installing. Matties: With this type of work, in terms of profitability, there's obviously a premium pric- ing, correct? Pedersen: My thinking is that the need is so big that you will be able to have some better profit than you have on multilayer boards. When we look at the market reports from Prismark and others that talk about the compound average growth rate (CAGR) for multilayer PCBs, it's something like 6%. Flex circuits are a little bit less, but if you look at the substrate-like PCBs, it's much higher. In IPC, we bought a report just before the last trade show that is based on substrate- like PCBs where they split between below- 25 or 25-micron track and gap and 30-micron track and gap, which is a substantial difference because it's a different technology that can reach it. But the CAGR is something like 15%, while a normal model layer would have 4 to 6%. I have a technology strategy within NCAB to deliver samples of ultra HDI within the year. We have already made them, we just don't