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42 PCB007 MAGAZINE I NOVEMBER 2022 is only a temporary solution. Remember to consider where you are today vs. where you want to be in the future. Where does the capi- tal need to go? Just remember, whether you decide to invest or delegate, you want to find a partner that provides solutions and not just selling equipment. PCB007 Todd Kolmodin is VP of quality for Gardien Services USA and an expert in electrical test and reliability issues. To read past columns, click here. challenges, known cost of quality, and con- fidence that all industry/customer require- ments are met. Gained expertise to represent in quality audits for ISO, DLA, and 9100 are just another benefit. When drawing conclusions, whether it's time to invest or delegate, depends on your individual circumstances. Do you know your co st of qualit y? You need that in hand to make justifiable decisions regard- ing capacity and cost. I know it's hard to get past some trains of thought or percep- tions but sometimes reinventing the wheel or throwing capital at a squeaky wheel by Nolan Johnson IPC took a visionary step in October by hosting a two-day Advanced Packaging Symposium. Held at the Kimpton Monaco hotel in Washington, D.C., the event brought together industry experts, govern- ment representatives, advocacy groups, and man- ufacturers to discuss the strategic need for packag- ing capability, both advanced and traditional, out- side the Asian region. Opening day speakers included keynotes from TechSearch's Jan Vardaman, and Intel's Tom Rucker. Additional speakers throughout the day represented DoD, NIST, the European Union, Western Digital, IBM, AMD, Northrup Grumman, and BAE Systems. The second day's agenda included: SRC, SkyWa- ter, Amkor, Integra, Samsung, AT&S, AGC Tactonic, OKUNO, and Lam Research. A lively mid-morning panel was comprised of representatives from Aver- atek, Calumet, GreenSource Fabrication, Sanmina, and TTM. A recurring theme was the urgent need for in-region capabilities. Read the five interviews we conducted regard- ing this event along with photo coverage which we published in the November 2022 issue of SMT007 Magazine. Advanced Packaging Symposium Special Coverage