PCB007 Magazine


Issue link: https://iconnect007.uberflip.com/i/1484263

Contents of this Issue


Page 9 of 115

10 PCB007 MAGAZINE I NOVEMBER 2022 "We know what we know om firsthand expe- rience. We don't have a surefire way to measure our progress against our peers, so we don't put much time into worrying about it. Rather we focus on doing our part, working with our cus- tomers and suppliers to see and push what's pos- sible."—Todd Brassard e more we investigate UHDI in the cur- rent market, the more advanced packaging becomes a part of the conversation. e two emerging technologies lean on each other for their overall success. UHDI is the method by which state-of-the-art advanced packaging will be fabricated; substrates are creating a market for UHDI capabilities. Yet there are so many questions to be answered. At the recent IPC Advanced Pack- Understanding the UHDI Market aging Symposium, an organizer said he had expected the event to help refine the conversa- tion. Instead, the size and scope of the need and the challenges to deliver on the need only got larger as the conference went on. e I-Con- nect007 Editorial Team met with Calumet's Todd Brassard and Meredith LaBeau just prior to the symposium; the same sense of ambigu- ity is present in their conversation. Nolan Johnson: UHDI is coming over the hori- zon for our industry. ere are certainly IC design trends and manufacturing trends which are pushing us to even smaller features than we can do now, so this will be something that the industry needs to respond to. In a global sense, Calumet is a small shop, yet you've been work- ing on UHDI. Tell us about that. Feature Interview by the I-Connect007 Editorial Team

Articles in this issue

Archives of this issue

view archives of PCB007 Magazine - PCB007-Nov2022