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Page 98 of 115

NOVEMBER 2022 I PCB007 MAGAZINE 99 The burgeoning job market means our communities will need to recruit talent for years to come. Many companies view this as a challenge and have expressed concern that not enough students are graduating with engineering degrees. The Member of the European Parliament (MEP) Eva Maydell expressed to participants of IPC's European Executive Forum her commitment to see a European Chips Act that would bolster the entire semi- conductor ecosystem, includ- ing those segments critical to advanced packaging. Kelly Dack and Nolan Johnson explore the silver linings from the past two years, especially the importance of good communication. These skills are—as they have always been—key to the success of the project. IPC announced the September 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.12. According to a Comprehensive Research Report by Market Research Future (MRFR), "Copper Foil Market Information by Product, Form, Category, Distribution Channel, and Region—Forecast till 2030," the market is estimated to grow at a 10.31% CAGR to reach USD 17,321.8 Million by 2030. Schweizer Electronic AG and its subsidiary Schweizer Electronic (Jiangsu) Co. Ltd., based in Jiangsu, China (SEC), concluded a Contri- bution and Patent Transfer Agree- ment on 10 October 2022. For the latest news and information, visit PCB007.com IPC, European Parliament Work to Bolster European Chips Act Copper Foil Market Worth U$17.32B by 2030 at 10.31% CAGR North American PCB Industry Sales Up 14.6% in September Schweizer Electronic Inks Patent Transfer Agreement with China Subsidiary The New Chapter: Retaining Engineers in the Workplace Lessons Learned: Breaking Down the Four Types of Communication

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