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vPlate
®
– New vertical systems
solution for advanced HDI PCBs and
IC substrates
The increasing demand for finer lines and spaces within pattern plating technologies means that it is im-
portant to greatly reduce the touching of the panel surface in order to avoid damages to the dry film.
Our vPlate
®
equipment is specifically designed for the touchless transportation of PCB panels for advanced
manufacturing technologies such as SAP and (a)mSAP. It can be applied to various PCB types, ranging from
standard multi layer and HDI to advanced HDI, rigid-flex, and IC substrates, with fine lines and spaces
down to 8/8 µm. The vertical continuous copper plating equipment is fully automated and compatible with
our InPro
®
chemical process series for TH and BMV filling for advanced HDI, mSAP, and IC substrates, as
well as our conformal plating processes such as InPro® VLF and InPro
®
Flex 2. With vPlate
®
, Atotech
provides a one-stop-shop solution for effective equipment, software and process soltuions.
To find out more about vPlate
®
, scan the QR-Code to the right.
