NOVEMBER 2022 I PCB007 MAGAZINE 99
The burgeoning job market
means our communities will
need to recruit talent for years
to come. Many companies view
this as a challenge and have
expressed concern that not enough students are
graduating with engineering degrees.
The Member of the European
Parliament (MEP) Eva Maydell
expressed to participants of
IPC's European Executive
Forum her commitment to see
a European Chips Act that
would bolster the entire semi-
conductor ecosystem, includ-
ing those segments critical to
advanced packaging.
Kelly Dack and Nolan Johnson
explore the silver linings from the past
two years, especially the importance
of good communication. These skills
are—as they have always been—key
to the success of the project.
IPC announced the September 2022 findings from its
North American Printed Circuit Board (PCB) Statistical
Program. The book-to-bill ratio stands at 1.12.
According to a Comprehensive Research Report by Market Research Future (MRFR), "Copper Foil
Market Information by Product, Form, Category, Distribution Channel, and Region—Forecast till
2030," the market is estimated to grow at a 10.31% CAGR to reach USD 17,321.8 Million by 2030.
Schweizer Electronic AG and its
subsidiary Schweizer Electronic
(Jiangsu) Co. Ltd., based in Jiangsu,
China (SEC), concluded a Contri-
bution and Patent Transfer Agree-
ment on 10 October 2022.
For the latest news and information, visit PCB007.com
IPC, European
Parliament Work to
Bolster European
Chips Act
Copper Foil Market Worth U$17.32B by 2030 at 10.31% CAGR
North American PCB Industry Sales Up
14.6% in September
Schweizer Electronic Inks Patent Transfer
Agreement with China Subsidiary
The New Chapter: Retaining
Engineers in the Workplace
Lessons Learned: Breaking
Down the Four Types of
Communication
