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36 PCB007 MAGAZINE I DECEMBER 2022 Feature Article by Julia Gumminger IPC INTERNATIONAL IPC members are constantly working to move the electronics industry forward by developing new technologies, innovative pro- cesses, and testing methods—and working to find solutions to known technical challenges. e IPC APEX EXPO Technical Conference is the premier forum in North America where these challenges, solutions, and innovations are shared among colleagues and competitors alike. Sometimes the processes and methods used to organize such a conference require some innovations as well. anks to the many hours of dedication and attention to detail; an updated peer review process; and new tools utilized by the Technical Program Committee (TPC), which is chaired by both Dr. Stanton Rak, of SF Rak Company, and Dr. Udo Wel- zel, of Robert Bosch GmbH, the 2023 Techni- cal Conference at IPC APEX EXPO 2023 will feature the highest quality technical program. e TPC received over 120 technical paper abstracts during the open call for participa- tion and reviewed them all in a double-blind peer review process. Eighty-five papers were chosen to undergo the next phase of the peer review process. Each TPC member contrib- uted many hours of their time to review and offer feedback to the authors. e Technical Program Committee consists of subject matter experts from companies such as: Robert Bosch GmbH, NASA Goddard Space Flight Center, IBM Corporation, Collins Aerospace, Conti- nental Automotive Systems, Bose Corpora- tion, John Deere Electronic Solutions, TTM Technologies, Indium Corporation, Averatek, Northrop Grumman, Aegis Industrial So- ware, and others. Each paper submission was reviewed by at least two reviewers with areas of expertise similar to the authors. is ensured the technical merit could be reviewed as well as the novelty and potential impact of the data. Let's Get Technical