PCB007 Magazine

PCB007-Dec2022

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90 PCB007 MAGAZINE I DECEMBER 2022 progress in creating new applications out- side of radio-frequency identification (RFID) and organic light-emitting diodes (OLEDs). e latter is a true printed electronics solution that has successfully established a solid mar- ket presence. Other than that, no real "killer" app or paradigm shi technology has emerged from the current fray. e simple reality is that it's especially challenging to displace incum- bent products with entirely new design solu- tions that must first be developed, understood, and implemented. Applications Disposable electronics that can compete with paper are a compelling and intriguing prospect to marketers. However, before fully adopting this technology, we must consider the environmental impact of throw-away electron- ics and adequately prepare for end-of-life mat- ters. Assuming that these factors are taken into consideration, there are a variety of intriguing prospects and processes being suggested for the next generation of printed electronics. Further, thanks to its ability to rapidly print multiple conductive, insulating, and semi- conductor layers to form electronic circuits, printed electronics technology offers the ability to produce a simpler and larger integrated circuit (IC) at a much lower cost than using conven- tional fabrication methods, albeit with less functionality per unit area. e number of potential applica- tions for printed electronics technol- ogy is growing: Printing Methods Deciding which printing method to use is determined by both the require- ments of the printed layers and the properties of the printed materials, as well as the product's economic and technical considerations. Presently, printing technologies are divided between sheet-based and roll-to-roll- based approaches. Sheet-based techniques, such as inkjet and screen printing, are best for low-volume, high-precision work. Gravure, offset, and flexographic printing are more common for high-volume production, such as for solar cells, reaching 10,000 square meters per hour (m²/h). While offset and flexographic printing are mainly used for inorganic and organic conductors (the latter also for dielec- trics), gravure printing is especially suitable for quality-sensitive layers, like organic semi- conductors and semiconductor/dielectric- interfaces in transistors, due to its high layer image registration quality. Gravure printing is also suitable for inorganic and organic conduc- tors in terms of high resolution. Organic field- effect transistors and integrated circuits can be wholly prepared using mass-printing methods. Altogether, there are presently eight key manufacturing image transfer technologies that are either being employed or are proposed for printed electronics production (Figure 2). Traditional printing technologies: • Screen printing • Rotogravure printing • Flexographic printing • Offset printing Figure 2: Printing techniques compared by resolution ver- sus throughput. Arrow indicates soft lithography as a photo- imageable technique that is off the scale to the left 3 .

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