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96 PCB007 MAGAZINE I MARCH 2023 The last three years have been a challenge, from the pandemic to the circus of shenanigans in Washington, neither of which have been pleas- ant. So, it's not hard to figure out why we are all in this current situation. We're not quite in a recession but rather a stagnation. The winds of change have come, but many are still Wilson looking over "Tool Time" Tim's fence to see what he is going to do. It's time to go back to our sheds and sharpen the saw. The EIPC Winter Conference returned to the Metropolis of Lyon in eastern France this month. In 2018, the venue was Villeurbanne in the Auvergne-Rhône-Alpes region. Five years later the setting was the Groupama Stadium in Décines-Charpieu, and leaders of the European printed circuit community gathered in expectation of a spectacular programme of 16 presentations, a visit to a nuclear power station, and an invaluable networking opportunity. They weren't disappointed. The November issue of PCB007 Magazine included a fair amount of discussion on the growing need for ultra-high density interconnects (UHDI). UHDI is an area replete with manufacturing challenges due not only to the feature sizes this technology requires (< 50 micron or < 2 mils), but also the lack of familiarity U.S. manufacturers have with this technology. In an interview with Calumet's Todd Brassard and Meredith LaBeau, they stated that the U.S. is roughly 30 years behind the curve in manufacturing UHDI, which is likely the result of companies offshor- ing UHDI manufacturing for many years. How can we catch back up? One World, One Industry: Advanced Packaging Year in Review Over the past year, IPC has stepped up its efforts to educate policymakers and other key audiences on the importance of investing in the entire semi- conductor supply chain to achieve the goals of the CHIPS and Science Act, including in advanced packaging and printed circuit boards. Our message to policymakers is that building a more robust, domestic ecosystem for advanced electronics will require four key policy decisions. EIPC Winter Conference 2023: Day 1 Review Testing Todd: Turning Into the Wind The Chemical Connection: The Subtractive Vision TOP TEN EDITOR'S PICKS

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