Design007 Magazine

Design007-Aug2023

Issue link: https://iconnect007.uberflip.com/i/1505220

Contents of this Issue

Navigation

Page 3 of 87

4 DESIGN007 MAGAZINE I AUGUST 2023 FEATURE INTERVIEWS How Far Can We Trust AI? with Sheldon Fernandez PCB Design, Digital Twin, and Digital Transformation with David Wiens Model Citizens: Modelithics Q&A with Chris DeMartino FEATURE COLUMNS Integrating AI Into the PCB Design Flow by Barry Olney Circuit Simulation, SPICE, and AI by John Watson FEATURE ARTICLES Three Ways to Improve High-speed PCB Signoff, Part 1 by Brad Griffin 3D Electromagnetic Analysis by Yuriy Shlepnev Challenges in Modern PCB Design and Analysis by Steve Watt 18 22 64 10 52 28 42 60 AUGUST 2023 • FEATURE CONTENTS Simulation, Analysis, and AI As we learn in this month's issue, AI is already making inroads into the design cycle—and learn- ing from its successes and missteps. Today's simulation tools are now benefiting from machine learning and artificial intelligence. We're still a long way from "push-button" operation, but as AI becomes more "intelligent" and learns from its design mistakes, there's almost no limit to what AI could potentially offer PCB designers and engineers in the not-too-distant future. 22 18 52

Articles in this issue

Archives of this issue

view archives of Design007 Magazine - Design007-Aug2023