Issue link: https://iconnect007.uberflip.com/i/1505220
48 DESIGN007 MAGAZINE I AUGUST 2023 reflections from the component pads, via holes, and microstrip traces on the top side of the board (dips and spikes on TDR plots of the top graphs). at was also observed on the preliminary impedance continuity analysis in the ERC mode. e link requires optimization that can be done in this tool. Small cut-outs in the reference conductors below the signal pads Figure 5: Before and after: The top row geometries are potentially problematic, while the bottom row images show these structures after optimization. Figure 6: Results of the adjustments shown in Figure 5.