Design007 Magazine

Design007-Aug2023

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50 DESIGN007 MAGAZINE I AUGUST 2023 For a selected link, Simbeor finds all possi- ble aggressor links and evaluates trace-to-trace and pad-to-pad coupling in mV (can be dB or %), assuming 1 V excitation with the rise time specified for the signal. It eliminates all types of geometrical proximity rules. To evaluate the system-level impact of the crosstalk, Fast SI or 3D SI analysis modes can be used. Fast SI mode includes crosstalk between the traces and pads and 3D SI option- ally adds crosstalk evaluation between the vias. e analysis can be done in frequency domain (PSXT, ICR, ICN, MDXT) as well as in time domain (step, pulse crosstalk or eye diagram with crosstalk) as illustrated in Figure 8. e top graphs show power sum crosstalk (PSXT) at the BGA and connector pads and the bottom graphs show the pulse crosstalk for 32 GT/s signal with 25 ps rise time and 0.5 V excitation. 3D SI analysis is used for this example. e upcoming release further pushes the boundary of possibilities with the extensions in EM solvers to build accurate models at frequencies over 50 GHz, and new capa- bilities can increase productivity of PCB designers. DESIGN007 References 1. "How Interconnects Work: Bandwidth for Mod- eling and Measurements," by Yuriy Shlepnev, Sim- berian App Note #2021_09, November 8, 2021 2. "Sink or swim at 28 Gbps," by Yuriy Shlepnev, The PCB Design Magazine, October 2014, p. 12-23. 3. "Machine Learning Applications for COM Based Simulation of 112Gb Systems," by A. Manukovsky, Y. Shlepnev, Z. Khasidashvili, E. Zalianski, DesignCon 2020. 4. "Life beyond 10 Gbps: Localize or Fail!" by Yuriy Shlepnev, April 13, 2018, Simberian App Note #2018_03. 5. "How Interconnects Work: Impedance and Reflections," by Yuriy Shlepnev, Simberian App Note #2021_11, December 22, 2021. 6. How Interconnects Work: Reflections from Dis- continuities, by Yuriy Shlepnev, Simberian App Note #2022_01, January 10, 2022. 7. "40 GHz PCB Interconnect Validation: Expec- tation vs. Reality," by M. Marin and Y. Shlepnev, DesignCon2018. This was the award-winning paper from DesignCon 2018. 8. "Effect of PCB Fabrication Variations on Inter- connect Loss, Delay, Impedance and Identified Material Models for 56-Gbps Interconnect Designs," by A. Manukovsky, Y. Shlepnev. Nominated for Best Paper Award at DesignCon 2019. Yuriy Shlepnev is president of Simberian Inc.

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