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62 DESIGN007 MAGAZINE I AUGUST 2023 In addition to chips and boards, it is crucial for SI and PI analysis to extend to the package level, particularly when designs use innova- tive packaging technologies, such as chiplet and MEMS. e package itself can introduce unique SI and PI challenges, such as signal reflections and power noise, which necessi- tate detailed analysis and mitigation strategies. Understanding and addressing these package- level considerations is essential to ensure opti- mal SI and PI throughout the design. With today's modern EDA tools, design engi- neers can leverage the power of system-level SI, PI, and EMI analysis to perform comprehensive evaluations using IBIS models. is advanced capability empowers design engineers to identify and mitigate potential problems at an early stage in the design process, which can help to reduce the time and cost of product development. Requirements-aware Design and Optimization e increasing complexity of electronic products is driving the adoption of system-level design and digital engineering methodologies. ese new design paradigms take a holistic view of the product and then deconstruct it into subsystems. e architectural subsystems, which typically encompass elements such as PCBs, cables, enclosure data (mechanical), boot loader soware, etc., necessitate collect- ing and documenting various requirements. When considering usage within a PCB data subsystem, the architectural requirements introduce unique specifications and function- alities for analysis, verification, and traceabil- ity in the electrical design process. Ensuring optimized architecture prior to moving into the detailed design stage is more critical than ever. Entering the detailed design stage with a flawed architecture can lead to schedule and cost overruns, plus increase the risk of project cancellation. In cases where a requirement can't be met, such as cost restraints, it is necessary to revisit the archi- tecture proposal and the specific requirement from a system-level perspective. Identify- ing unachievable design requirements during architecture verification can eliminate the need for costly design changes further downstream. Artificial Intelligence in PCB Design: Enhancing the Design Process Artificial intelligence is a prominent topic across the technology world, and PCB design is no exception. We have dedicated substantial development efforts in this rapidly growing area of technology. e result is the release of various AI functionalities in our products with additional exciting features on the horizon. Our primary objective is to ensure an accel- erated design process that mimics human-like expertise. is does not imply that we see the future obsolescence of PCB designers— far from it. We see these innovations driving change in the design process. For instance, if AI handles the place and route stage of a design, it's not out of the question that a designer could spawn multiple sessions and assess the viability of each result. Rather than extending maximum brute force effort on a particular design path and relying on trial and error, designers can quickly explore various layer stackups or line/vias combina- tions to determine the optimal path forward. is is a simple example of how AI technology could shi the focus of the designers' efforts, and we are confident that other possibilities will emerge as this groundbreaking technology continues to advance. Zuken is leading the way in AI for PCB design, introducing various new functionalities to accelerate and enhance the design process. While human designers will always be crucial, AI presents new opportunities to reimagine how we approach design. DESIGN007 Steve Watt is PCB engineering manager with Zuken.