Design007 Magazine
Design007-Aug2023
Issue link:
https://iconnect007.uberflip.com/i/1505220
Contents of this Issue
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Articles in this issue
Design007 Magazine — August 2023
Feature Contents — Simulation, Analysis, and AI
Additional Contents
Column — Simulation, Analysis, and AI
Short — MIT Engineers Create An Energy-storing Supercapacitor from Ancient Materials
Feature Column — Integrating AI Into PCB Design Flow
Short — Researchers Achieve Historic Milestone in Energy Capacity of Supercapacitors
Feature Interview — How Far Can We Trust AI?
Feature Interview — PCB Design, Digital Twin, and Digital Transformation
Feature Article — Three Ways to Improve High-speed PCB Signoff, Part 1
Short — IPC E-Textiles Committee A-Teams Are Shaping Some Much-needed Standards
Column — Best Drilling Practices for Better PCB Manufacturing
Short — BOOK EXCERPT: The Printed Circuit Designer's Guide to… Manufactururing Driven Design
Feature Article — 3D Electromagnetic Analysis
Feature Column — Circuit Simulation, SPICE, and AI
MilAero007 Highlights
Feature Article — Challenges in Modern PCB Design and Analysis
Infographic: EDA By the Numbers
Q&A — Model Citizens: Modelithics
Short — Revolutionary Self-Sensing Electric Artificial Muscles
Flex007 Highlights
Column — The Growth of Flex-hybrid Electronics in Mil-Aero Applications
Short — A Foundation That Fits Just Right Gives Superconducting Nuckelates a Boost
Top Ten Editor's Picks
Career Opportunities section
Educational Resources
Advertiser Index and Masthead
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