Issue link: https://iconnect007.uberflip.com/i/1506834
58 SMT007 MAGAZINE I SEPTEMBER 2023 The Specific Provisions of the U.S. CHIPS Act Relevant to Equipment Suppliers: Balancing R&D Customization with Scalability Delving into the specifics of the U.S. CHIPS Act, several provisions directly impact equip- ment suppliers. e Act's focus on bolster- ing domestic chip production and advanced packaging presents equipment suppliers with a prime opportunity to align their innovations with the Act's mandates. For instance, pro- visions related to research and development incentives and support for advanced manufac- turing processes resonate deeply with equip- ment suppliers aiming to offer cutting-edge solutions tailored to semiconductor manufac- turers' evolving needs. e challenge of balancing customization with scalability looms large. To address this, suppliers are leveraging modular design prin- ciples, enabling them to swily tailor equip- ment features while maintaining cost-effec- tiveness during larger-scale deployment. e synergy between customization and scalabil- ity empowers manufacturers to benefit from bespoke solutions without compromising operational efficiency. A Glimpse Into the Horizon: Advanced Manufacturing and Collective Transformation e semiconductor industry's projected growth presents a favorable outlook for both manufacturer and supplier. With the imple- mentation of the U.S. CHIPS Act stimulating domestic chip production and advanced pack- aging, the demand for cutting-edge equipment is poised to rise. Projections indicate a signif- icant uptick in equipment orders as manufac- turers strive to align with the Act's mandates.