SEPTEMBER 2023 I SMT007 MAGAZINE 89
IRR1: Programs Addressing High Reliabil-
ity and Mission Critcial Applications
Tuesday, October 10
11 a.m.–12:30 p.m. CDT
"A Collaborative Consortia Project to Assess the
Effect of Thermal Cycling Dwell Time on the Reli-
ability of High-Performance Solder Alloys"
Presenter: Richard Coyle, Nokia Bell Lab
"The USPAE Solder Performance and Reliability
Assurance Project: Test Plan"
Presenter: Michael Osterman, Ph.D., University of
Maryland-CALCE-EPSC
"Graphical Representations of Challenges
Regarding Implementation of Pb-free Materials
in Aerospace and Defense Electronics"
Presenter: Anthony Rafanelli, Raytheon
Technologies
MAT1
Tuesday, October 10
11 a.m.–12:30 p.m. CDT
"The Intermediate Diffusion Barrier Performance
of Electroless Co-W-B / Ni-P Stacked Deposits
Between Cu and Solder Joint"
Presenter: Yoshihito Li, Hiroki Okubo, Shoi-
chi Hukui, Tetsuji Ishida, Shoji Iguchi, Katsuhisa
Tanabe, Shigeo Hashimoto, C. Uyemura & Co., Ltd.
"Thermal Properties and Reliability of Liquid
Metal Alloys Containing Organic Additive as
Thermal Interface Materials for Computing
Electronics Device"
Presenters: Guangyu Fan, Jeffrey Kurish, John
Lamb, Indium Corporation; Michael Beam, Jacob
Wicker, Wakerley Banker, Alexander Bonacci,
SUNY Polytechnic Institute
"Selecting the Right Adhesive for Your
Electronics Application"
Presenter: David Spitz, Ansys, Inc.
APT2: Package Assembly Process 2
Tuesday, October 10
1:30–3:00 p.m. CDT
"Using Piezoelectric Sensors to Measure Dynamic
Force in Semiconductor Applications"
Presenter: Robert Hillinger, Kistler Instrumente
"Assembly Solutions for Cost-Effective Heteroge-
neous Integration with Disparate Die Types"
Presenter: Glenn Farris, Universal Instruments
"Innovative Soldering Materials
for Ball-Attach Processes on
Advanced Packages"
Presenter: Evan Griffith,
Indium Corporation
IRR2: Design Considerations
for Reliability
Tuesday, October 10
1:30–3:00 p.m. CDT
"Impact of BGA Escape Trace Design on Thermo-
Mechanical Performance of Solder Joint"
Presenters: Cheng-Hao Chin, Gnyaneshwar
Ramakrishna, Cisco Systems
"Design Considerations That Influence LED Solder
Joint Reliability on IMS Printed Circuit Boards"
Presenter: Michael Blattau, Ansys, Inc.
"Next-Generation Pin-in-Ball and Non-Solder
Ball Grid Arrays Demonstrate Advancements
in Surface-Mount Area Array Solder Joint
Attachment With the Capacity to Satisfy
IPC-A-610 and IPC J-STD-001 Class 3 Criteria"
Presenters: Robbie Huffman, David Decker,
Samtec, Inc.
MAT2
Tuesday, October 10
1:30–3:00 p.m. CDT
"Sustainable Nanocoating Technology for
Corrosion Protection of Electronics"
Presenter: Rakesh Kumar, Frank Ke and Dustin
England, Specialty Coating Systems, Inc.
"Restoration of Tin-Over-Copper Plating on
Electronic Components and Circuit Boards
Exhibiting Cu-Sn Intermetallic Breakthrough
and Severe Surface Oxidation"
Presenter: Scott Nelson, SemiPack Services Inc;
Dana Imler, Superior Flux
"A Novel Surface Finish Can Achieve Robustness
Against Copper Creep Corrosion for Better
Reliability of Printed Circuit Boards (PCBs)"
Presenters: Kunal Shah, Lilotree; Dem Lee,
Jeffrey Lee, Integrated Service Technology Inc.
