94 SMT007 MAGAZINE I SEPTEMBER 2023
INS4: Advanced Process Test and
Inspection Applications and
Case Studies
Thursday, October 12
10:30 a.m.-12 p.m. CDT
"Quantifying the Relationship Between
Water-Soluble Flux Residue Time on a PCB
and SIR Performance"
Presenters: Joshua Dobransky, Thuy Nguyen,
Indium Corporation
"Accelerated Corrosion Testing of DRAM
Modules for Data Centers: Investigation
of Methodology Approach and Corrosion
Mitigation Solution"
Presenters: Kwangwon Seo, Ph.D.,
Dongmin Jang, Jaeseok Jang, Seungyeong Lee,
Samsung Electronics
"Correlation of Solder Paste Reflow Defects
and Electrochemical Impedance Spectroscopy
Measurements"
Presenters: Carson Burt, Adam Murling, Indium
Corporation; Morgan Miller, Insituware
LTS5: Improving Process Yield,
Quality and Reliability with Low
Temperature Solders
Thursday, October 12
10:30 a.m.-12 p.m. CDT
Chair: Prabjit Singh, IBM Corporation
Co-Chair: Hannah Fowler, Purdue University
"Complex Board Design Induced Solder
Separation Failure: Mechanism and Mitigation
Using Low Melting Temperature Interconnects"
Presenters: Tae-Kyu Lee, Gnyaneshwar
Ramakrishna, Cisco Systems; Jonghyun Nam,
Daljin Yoon, Heera Roh, SK Hynix
"A Study on the Improvement of Module
Assembly Process and Reliability Using
Sn-Bi Low Temperature Solder Paste"
Presenters: Jinwoo Jang, Dongmin Jang, Jaeseok
Jang, Seungyeong Lee, Samsung Electronics
"Homogeneous Low Temperature Solder
Technology - Quality and Reliability
Considerations for Ball Grid Array Components"
Presenter: Rajen Sidhu, Ph.D., AMD
MFX5: Cleaning Challenges
Thursday, October 12
10:30 a.m.-12 p.m. CDT
"Revolutionizing PCB Assembly Cleaning:
The Next Generation of pH-Neutral
Defluxing Agents"
Presenter: Ravi Parthasarathy, M.S.Ch.E.,
ZESTRON Corporation
"Qualifying and Validating the SMT Cleaning
Process using a Glass Test Vehicle"
Presenter: Vladimir Sitko, PBT Works s.r.o.; Mike
Bixenman, DBA, DBA, Magnalytix, LLC
"Molecular Fingerprint of Condensate
Residues in the Soldering Process:
Detailed FT-IR Spectroscopic Analyses
and Identification of Reaction Partners"
Presenter: Viktoria Rawinski, Rawinski GMBH
MFX6: NPI Challenges
Thursday, October 12
1-3 p.m. CDT
"Highlighting Component-Related Gaps
to Ensure a Seamless PCBA Design-to-
Manufacturing and Reliability"
Presenters: Arnaud Grivon, Shaïma Enouz-
Vedrenne, Raphaël Hudé, Thales Global Services
"Conquering the Bogeyman: Mitigating
Obsolescence Challenges Before They Occur"
Presenters: Vernon Densler, Katy Ackerman,
Sourceability LLC
"3D Printing for Electronics Tooling"
Presenters: Dan Migley, Impossible Objects
