Issue link: https://iconnect007.uberflip.com/i/1506834
SEPTEMBER 2023 I SMT007 MAGAZINE 9 U.S., but in Europe as well. In October 2022, for example, IPC hosted a two-day symposium on advanced packaging in D.C., helping to set the stage for educating government officials on the complexities of the electronics manufac- turing ecosystem. is past April, IPC Europe hosted a silicon-to-systems meeting in Brus- sels, and plans a second symposium early next year on advanced packaging, also in Europe. In this issue, I've included updates from U.S. Reps. Blake Moore and Anna Eshoo, the two originating sponsors for HR 3249, also known as the Protecting Circuit Boards and Substrates Act. We also include a summary and the opinion piece Rep. Eshoo wrote for the San Jose newspaper, and the announce- ment from Rep. Moore's office about the pending legislation. Finally, Kirk omp- son of Isola provides a more detailed look at advanced packaging, which continues to emerge as a key area of development related to CHIPS Act funding. Personally, I continue to be impressed by the scale and persistence shown by all the organi- zations advocating for electronics manufactur- ing, particularly the groups educating govern- ment officials on printed circuit manufacturing technologies. If Chatterji worked to raise aware- ness from the top, it's our advocates who've been bringing the same awareness in, as it were, from the bottom. ank you, Ronnie Chatterji, for your thoughtful and effective leadership; this will undoubtedly have an impact. As KIC's Miles Moreau writes in his article, the CHIPS Act "ushers in an era of innovative manufactur ing paradigms. Semiconduc- tor manufacturers have the chance to explore cutting-edge processes, with technologies such as extreme ultraviolet (EUV) lithogra- phy and advanced packaging process advance- ments assuming center stage. is inter- section of innovation and partnership with equipment suppliers is poised to shape the trajectory of these transformative processes, bridging the gap between theory and practi- cal application." Which brings me to our cover art this month. If you haven't already become familiar with the rallying cry for our advocates, it's "Chips don't float." Semiconductor manufacturing simply cannot exist in a vacuum, as we industry insid- ers know. But others outside the industry oen are not aware. "Chips don't float" has been a highly effective takeaway, cementing the understanding that electronics manufacturing requires an ecosystem. Between advocacy and governmental subsidies, the dynamic is mov- ing from an industry drowning to an indus- try with a life ra, heading toward firm, new footing in the future. One might argue that circuit board assem- bly is just about soldering components to bare boards. We all know this will change the EMS industry. Just the advances in advanced pack- aging will present new challenges to assembly, inspection, test, and rework. Changes of this magnitude have a way of changing the entire ecosystem as well. So, where do we expect to see those changes? at's the question we begin to answer with this issue. Not to be forgotten in all this is the upcoming SMTA International Conference and Exposi- tion in early October in Minnesota. Inside this issue, you'll find a special section devoted to the conference, with a welcome from SMTA President Martin Anselm, details about the technical conference and Women's Leader- ship Program. In his column this month, Mike Konrad shares more details about the event's technical program. I hope to see you in Minne- apolis. Stop by and say hello! SMT007 Reference 1. "White House Advisor on Microchips Steps Down, Politico.com. Nolan Johnson is managing editor of SMT007 Magazine. Nolan brings 30 years of career experience focused almost entirely on electronics design and manufacturing. To contact Johnson, click here.