PCB007 Magazine


Issue link: https://iconnect007.uberflip.com/i/1507822

Contents of this Issue


Page 29 of 115

30 PCB007 MAGAZINE I SEPTEMBER 2023 When I joined the company, I first asked where we were heading and where the market was going. For our major customers, what were their projected unmet needs? I asked our CTO to talk with the CTOs of our major customers as a way to develop a multi-industrial vision with advanced technology included. Of course, when you ask CTOs about their unmet needs, you get much feedback from dif- ferent angles. When you filter out all the feed- back, we found three major issues that keep repeating. Matties: What were those issues? First was miniaturization. Second was heat dissipation management, which is very much connected to the miniaturization of more func- tionalities and the growing demand for high- power applications. e third was the registra- tion of mixed materials. Oved Shapira is CEO of PCB Technologies, the Israeli-based printed circuit provider. PCB Technologies has recently invested in facilities and expertise to design, fabricate, and assem- ble substrates, a key component for advanced packaging technologies. Oved spoke with Barry Matties and Nolan Johnson about how advanced packaging will influence the indus- try. He said it will shi everything, includ- ing design, fabrication, assembly techniques, and capital equipment development. Some of these shis might be subtle, and others more seismic. Whatever the changes, Oved says it's coming. Barry Matties: Since you joined the company, you have been instrumental in defining the direction for PCB Technologies. Could you give us an overview of the company's current strategic direction? Pivoting on Substrates Feature Interview by the I-Connect007 Editorial Team

Articles in this issue

Archives of this issue

view archives of PCB007 Magazine - PCB007-Sep2023