Issue link: https://iconnect007.uberflip.com/i/1508761
20 SMT007 MAGAZINE I OCTOBER 2023 Virani: AI-based inspection systems have five key components: 1. Optics/lighting: Taking images of the PCBA, components, and defects. 2. Material handling: Conveyor and logic to move PCBAs through the system. 3. Artificial intelligence models: Analyze PCBA images for defects and additional information. 4. Line interface: Interface for operator to monitor and control inspection. 5. Engineer/quality user interface: Inter- face to enable AI learning and continuous improvement of inspection performance. What are the different types of automatic inspection systems commonly used in electronics manufacturing, and when is each type most appropriate? D'Amico: ere are many types of automated inspection systems used in electronics man- ufacturing, including solder paste inspection (SPI), automated optical inspection (AOI), flying probe, and X-ray. Each of these systems is used at a variety of different locations within the manufacturing process. SPI is primar- ily used post-solder deposition but may also be used for inspection of deposition of adhe- sives. AOI may be used either post-placement or post-reflow to verify the proper placement and electrical connectivity of each component on the PCB. Flying probe is used to check elec- trical characteristics of the finished PCB aer optical inspection for manufacturing defects. X-ray may be used at virtually any phase of the manufacturing process but is primarily used to inspect solder connectivity for bottom termi- nated devices. Scutchfield: SPI systems inspect the solder paste aer print to confirm the position and volume of the print vs. the expected values for each. AOI can be used in various locations with different flavors, including a less com- plex offering (fewer projectors) for pre-reflow i n s p e c t i o n , w h e r e we're looking to con- firm that all the parts are correct, and they have been accurately p la c e d i n t h e r i g h t location and the cor- rect polarity. e use of pre-reflow AOI con- tinues to grow quickly for many valid reasons, some of which are related to the components and labor shortages that many EMS provid- ers are still dealing with. Systems used in the pre-reflow location are typically less com- plex with regard to the number of projectors and camera complexity, because the inspec- tions being performed in this location can be done effectively with such systems, which are typically also less costly. For post-reflow AOI inspection (most common location for AOI), the more complex systems are typically used due to the need to inspect solder joints and the properties that come with solder joint inspec- tion, including hidden joints, and very reflec- tive solder. AOI is also used for pin and termi- nal inspection where a high content of both is present. ese systems typically require some difference in the configuration, due to the reflective nature of plated pins and termi- nals. rough-hole inspection can fall into this same category. Dispensed process inspection is also used where the need for conformal coat- ing, underfill, or potting inspection is needed to confirm thickness and/or volume of each. Virani: e types of automatic inspection sys- tems commonly used in electronics manufac- turing can be categorized as follows: A. Visual inspection is the most flexible and versatile amongst the types of automatic inspection systems, and is appropriate at dif- ferent stages of the electronics manufacturing process including: • Parts inspection, such as the initial parts arrival stage, to check whether received parts are damaged