Issue link: https://iconnect007.uberflip.com/i/1508761
OCTOBER 2023 I SMT007 MAGAZINE 21 the need for human intervention. e data that inspection systems provide is now thought to be the most critical and important information that can be gathered to run the SMT line prop- erly. So, those results must be correct and very reliable. e performance and success of the line depends on it. V i r a n i : A u t o m a t i c i n s p e c t i o n s y s t e m s offer a consistent and accurate way to iden- tify defects. ese sys- tems are especially use- ful for complex printed circuit board assem- b l i e s ( P C B A s ) t h a t contain thousands of components, as they can complete inspections much faster than human inspectors, thus improving cycle time. Moreover, newer AI-based inspection sys- tems are cost-effective and can be deployed across multiple locations within the produc- tion process. is helps to catch defects in real- time, as they occur, allowing for prompt cor- rective action. Additionally, the end-to-end data collected by these systems provides valu- able insights into the production process, high- lighting opportunities for improvement. What are some of the common challenges or limitations associated with automatic inspec- tion systems in electronics manufacturing, and how can they be addressed? D'Amico: e continuing evolution toward advanced miniature packaging has led to ever-increasing PCB density and complexity. is adds an increased number of challenges and limitations for each automated inspec- tion system within the manufacturing process. For instance, smaller discrete devices such as 01005s and 030015s, as well as micro-BGA and CSP devices, require very small solder depo- sitions, and that adds a level of complexity for the SPI process. ese smaller devices also require higher resolution optics, lighting, and • Placement, to check whether components are placed properly/not missing/ damaged, and whether the components are the right ones • Solder reflow stage to ensure parts are properly soldered • Hand load through-hole stage to ensure proper placement • Final assembly stage to ensure that components have not moved/become missing/wrong polarity/damaged, and sol- der is not missing/creating bridges • Wash stages to ensure components and solder have not been washed away/ damaged B. Non-destructive testing, such as X-ray inspection systems, is most appropriate for situations where you need to look below or within a component for damage (e.g., BGA solder paste inspection) and most appropri- ate at the parts arrival stage and final inspec- tion stage. C. Functional testing and in-circuit testing (ICT) are most appropriate at the final assem- bly stage to determine whether the board is producing the desired results and to electri- cally probe the assembled electronics to check for shorts, opens, and capacitance. How do automatic inspection systems con- tribute to improving quality control and reduc- ing defects in electronics manufacturing? D'Amico: e whole purpose of test and inspec- tion is to collect actionable data that may be used to reduce defects and maximize efficiency within the manufacturing line. e goal is to minimize scrap and get a really good handle on those process parameters that need to be put in place to manufacture products the right way the first time. Scutchfield: It all starts with having the right kind of measurement-based data, and then applying it the right way, both manually and in an automated fashion where possible, to reduce