Issue link: https://iconnect007.uberflip.com/i/1512857
Design Tomorrow's Technology Today 2024 COURSE SCHEDULE FOR JANUARY TO APRIL More than 500 students experienced the personalized instruction of IPC's instructor-led courses. Start the year mastering Mil-Aero Applications, Radio Frequency Boards or learning the fundamentals with Introducation to Design I & II. COURSE NAME DATES DAYS TIME PCB Design for Military, Aerospace & Other Extreme Applications Jan. 22–Feb. 28 M/W 8 am PT/11 am ET/5 pm CET PCB Design for Radio Frequency Boards Jan. 22–Feb. 28 M/W 3:30 pm PT/6:30 pm ET PCB Design I section 1 Jan. 23–Feb. 29 T/TH 8 am PT/11 am ET/5 pm CET PCB Design I section 2 Jan. 23–Feb. 29 T/TH 3:30 pm PT/6:30 pm ET PCB Design for Manufacturability Feb. 20–Mar. 7 T/TH 9 am PT/12 pm ET/6 pm CET New Course: BGA, BTC & PoP Packaging & Assembling – Materials, Processes, and Reliability Feb. 27–Mar. 14 T/TH 8 am PT/11 am ET/5 pm CET Certified Electronics Program Manager Feb. 27–Apr. 4 T/TH 2:30 pm PT/5:30 pm ET PCB Design II section 1 Mar. 18–May 15 M/W 8 am PT/11 am ET/5 pm CET PCB Advanced Design Concepts Mar. 18–May 15 M/W 3:30 pm PT/6:30 pm ET PCB Design II section 2 Mar. 19–May 16 T/TH 3:30 pm PT/6:30 pm ET PCB Design I (Brazil) Apr. 22–May 29 M/W 7 pm BST/ 6 pm ET Top Lead-free Production Defects & Issues – Causes, Remedies & Prevention Apr. 23–May 2 T/TH 8 am PT/11 am ET/5 pm CET New Course: Counterfeit Electronic Parts Mitigation in Mission Critical & Life Saving Supply Chains Apr. 23–May 16 T/TH TBD Traditional DFM: Is it Dead or Alive? May 6-8 M/W 3:30 pm PT/6:30 pm ET New Course: Gold-Aluminum Wire Bonding Chip Assembly Process, Quality and Reliability May 7-16 T/TH 8 am PT/11 am ET/5 pm CET New Course: Press-Fit Technology May 7-30 T/TH 8 am PT/11 am ET/5 pm CET PCB Design for Rigid Flex Boards June 3–July 10 M/W 3:30 pm PT/6:30 pm ET PCB Design I June 3–July 10 M/W 3:30 pm PT/6:30 pm ET COURSE NAME DATES DAYS TIME # OF WEEKS Design for Military, Aerospace & Other Extreme Applications Jan. 22–Feb. 28 M/W 8 am PT/11 am ET/5 pm CET 6 Design for Radio Frequency Boards Jan. 22–Feb. 28 M/W 3:30 pm PT/6:30 pm ET 6 Design I section 1 Jan. 23–Feb. 29 T/TH 8 am PT/11 am ET/5 pm CET 6 Design I section 2 Jan. 23–Feb. 29 T/TH 3:30 pm PT/6:30 pm ET 6 Design for Manufacturability Feb. 20–Mar. 7 T/TH 9 am PT/12 pm ET/6 pm CET 3 Course: BGA, BTC & PoP Packaging & Assembling – Processes, and Reliability Feb. 27–Mar. 14 T/TH 8 am PT/11 am ET/5 pm CET 3 Electronics Program Manager Feb. 27–Apr. 4 T/TH 2:30 pm PT/5:30 pm ET 6 Design II section 1 Mar. 18–May 15 M/W 8 am PT/11 am ET/5 pm CET 8 Advanced Design Concepts Mar. 18–May 15 M/W 3:30 pm PT/6:30 pm ET 8 Design II section 2 Mar. 19–May 16 T/TH 3:30 pm PT/6:30 pm ET 8 Design I (Brazil) Apr. 22–May 29 M/W 7 pm BST/ 6 pm ET 6 Lead-free Production Defects & Issues – Causes, Remedies & Prevention Apr. 23–May 2 T/TH 8 am PT/11 am ET/5 pm CET 2 Course: Counterfeit Electronic Parts Mitigation in Mission Critical & Life Saving Supply Chains Apr. 23–May 16 T/TH TBD 4 DFM: Is it Dead or Alive? May 6-8 M/W 3:30 pm PT/6:30 pm ET 1 Course: Gold-Aluminum Wire Bonding Chip Assembly Process, Quality and Reliability May 7-16 T/TH 8 am PT/11 am ET/5 pm CET 2 Course: Technology May 7-30 T/TH 8 am PT/11 am ET/5 pm CET 4 Design for Rigid Flex Boards June 3–July 10 M/W 3:30 pm PT/6:30 pm ET 6 Design I June 3–July 10 M/W 3:30 pm PT/6:30 pm ET 6 "I liked the approach the instructor took for full participation of all students." WHAT STUDENTS ARE SAYING! "The live interaction facilitated asking questions that helped clarify the information." "The material of this course was great." "The instructor explained the course in detail, in a way that can be understood by everyone." "The recorded lectures help me to review the training materials at my convenient time." COURSE NAME DATES DAYS TIME PCB Design for Military, Aerospace & Other Extreme Applications Jan. 22–Feb. 28 M/W 8 am PT/11 am ET/5 pm CET PCB Design for Radio Frequency Boards Jan. 22–Feb. 28 M/W 3:30 pm PT/6:30 pm ET PCB Design I section 1 Jan. 23–Feb. 29 T/TH 8 am PT/11 am ET/5 pm CET PCB Design I section 2 Jan. 23–Feb. 29 T/TH 3:30 pm PT/6:30 pm ET PCB Design for Manufacturability Feb. 20–Mar. 7 T/TH 9 am PT/12 pm ET/6 pm CET New Course: BGA, BTC & PoP Packaging & Assembling – Materials, Processes, and Reliability Feb. 27–Mar. 14 T/TH 8 am PT/11 am ET/5 pm CET Certified Electronics Program Manager Feb. 27–Apr. 4 T/TH 2:30 pm PT/5:30 pm ET PCB Design II section 1 Mar. 18–May 15 M/W 8 am PT/11 am ET/5 pm CET PCB Advanced Design Concepts Mar. 18–May 15 M/W 3:30 pm PT/6:30 pm ET PCB Design II section 2 Mar. 19–May 16 T/TH 3:30 pm PT/6:30 pm ET PCB Design I (Brazil) Apr. 22–May 29 M/W 7 pm BST/ 6 pm ET Top Lead-free Production Defects & Issues – Causes, Remedies & Prevention Apr. 23–May 2 T/TH 8 am PT/11 am ET/5 pm CET New Course: Counterfeit Electronic Parts Mitigation in Mission Critical & Life Saving Supply Chains Apr. 23–May 16 T/TH TBD Traditional DFM: Is it Dead or Alive? May 6-8 M/W 3:30 pm PT/6:30 pm ET New Course: Gold-Aluminum Wire Bonding Chip Assembly Process, Quality and Reliability May 7-16 T/TH 8 am PT/11 am ET/5 pm CET New Course: Press-Fit Technology May 7-30 T/TH 8 am PT/11 am ET/5 pm CET PCB Design for Rigid Flex Boards June 3–July 10 M/W 3:30 pm PT/6:30 pm ET PCB Design I June 3–July 10 M/W 3:30 pm PT/6:30 pm ET Advanced Troubleshooting & Defect Analysis June 4–June 27 T/TH 8 am PT/11 am ET/5 pm CET COURSE NAME DATES DAYS TIME PCB Design for Military, Aerospace & Other Extreme Applications Jan. 22–Feb. 28 M/W 8 am PT/11 am ET/5 pm CET PCB Design for Radio Frequency Boards Jan. 22–Feb. 28 M/W 3:30 pm PT/6:30 pm ET PCB Design I section 1 Jan. 23–Feb. 29 T/TH 8 am PT/11 am ET/5 pm CET PCB Design I section 2 Jan. 23–Feb. 29 T/TH 3:30 pm PT/6:30 pm ET PCB Design for Manufacturability Feb. 20–Mar. 7 T/TH 9 am PT/12 pm ET/6 pm CET New Course: BGA, BTC & PoP Packaging & Assembling – Materials, Processes, and Reliability Feb. 27–Mar. 14 T/TH 8 am PT/11 am ET/5 pm CET Certified Electronics Program Manager Feb. 27–Apr. 4 T/TH 2:30 pm PT/5:30 pm ET PCB Design II section 1 Mar. 18–May 15 M/W 8 am PT/11 am ET/5 pm CET PCB Advanced Design Concepts Mar. 18–May 15 M/W 3:30 pm PT/6:30 pm ET PCB Design II section 2 Mar. 19–May 16 T/TH 3:30 pm PT/6:30 pm ET PCB Design I (Brazil) Apr. 22–May 29 M/W 7 pm BST/ 6 pm ET Top Lead-free Production Defects & Issues – Causes, Remedies & Prevention Apr. 23–May 2 T/TH 8 am PT/11 am ET/5 pm CET New Course: Counterfeit Electronic Parts Mitigation in Mission Critical & Life Saving Supply Chains Apr. 23–May 16 T/TH TBD Traditional DFM: Is it Dead or Alive? May 6-8 M/W 3:30 pm PT/6:30 pm ET New Course: Gold-Aluminum Wire Bonding Chip Assembly Process, Quality and Reliability May 7-16 T/TH 8 am PT/11 am ET/5 pm CET New Course: Press-Fit Technology May 7-30 T/TH 8 am PT/11 am ET/5 pm CET PCB Design for Rigid Flex Boards June 3–July 10 M/W 3:30 pm PT/6:30 pm ET PCB Design I June 3–July 10 M/W 3:30 pm PT/6:30 pm ET Advanced Troubleshooting & Defect Analysis June 4–June 27 T/TH 8 am PT/11 am ET/5 pm CET PCB Design II June 4–July 25 T/TH 8 am PT/11 am ET/5 pm CET PCB Design for Military, Aerospace & Other Extreme Applications June 4–July 11 T/TH 3:30 pm PT/6:30 pm ET COURSE NAME DATES DAYS TIME # OF WEEKS Design for Military, Aerospace & Other Extreme Applications Jan. 22–Feb. 28 M/W 8 am PT/11 am ET/5 pm CET 6 Design for Radio Frequency Boards Jan. 22–Feb. 28 M/W 3:30 pm PT/6:30 pm ET 6 Design I section 1 Jan. 23–Feb. 29 T/TH 8 am PT/11 am ET/5 pm CET 6 Design I section 2 Jan. 23–Feb. 29 T/TH 3:30 pm PT/6:30 pm ET 6 Design for Manufacturability Feb. 20–Mar. 7 T/TH 9 am PT/12 pm ET/6 pm CET 3 Course: BGA, BTC & PoP Packaging & Assembling – Processes, and Reliability Feb. 27–Mar. 14 T/TH 8 am PT/11 am ET/5 pm CET 3 Electronics Program Manager Feb. 27–Apr. 4 T/TH 2:30 pm PT/5:30 pm ET 6 Design II section 1 Mar. 18–May 15 M/W 8 am PT/11 am ET/5 pm CET 8 Advanced Design Concepts Mar. 18–May 15 M/W 3:30 pm PT/6:30 pm ET 8 Design II section 2 Mar. 19–May 16 T/TH 3:30 pm PT/6:30 pm ET 8 Design I (Brazil) Apr. 22–May 29 M/W 7 pm BST/ 6 pm ET 6 Lead-free Production Defects & Issues – Causes, Remedies & Prevention Apr. 23–May 2 T/TH 8 am PT/11 am ET/5 pm CET 2 Course: Counterfeit Electronic Parts Mitigation in Mission Critical & Life Saving Supply Chains Apr. 23–May 16 T/TH TBD 4 DFM: Is it Dead or Alive? May 6-8 M/W 3:30 pm PT/6:30 pm ET 1 Course: Gold-Aluminum Wire Bonding Chip Assembly Process, Quality and Reliability May 7-16 T/TH 8 am PT/11 am ET/5 pm CET 2 Course: Technology May 7-30 T/TH 8 am PT/11 am ET/5 pm CET 4 Design for Rigid Flex Boards June 3–July 10 M/W 3:30 pm PT/6:30 pm ET 6 Design I June 3–July 10 M/W 3:30 pm PT/6:30 pm ET 6 Troubleshooting & Defect Analysis June 4–June 27 T/TH 8 am PT/11 am ET/5 pm CET 4 Design II June 4–July 25 T/TH 8 am PT/11 am ET/5 pm CET 8 Design for Military, Aerospace & Other Extreme Applications June 4–July 11 T/TH 3:30 pm PT/6:30 pm ET 6 COURSE NAME DATES DAYS TIME # OF WEEKS Design for Military, Aerospace & Other Extreme Applications Jan. 22–Feb. 28 M/W 8 am PT/11 am ET/5 pm CET 6 Design for Radio Frequency Boards Jan. 22–Feb. 28 M/W 3:30 pm PT/6:30 pm ET 6 Design I section 1 Jan. 23–Feb. 29 T/TH 8 am PT/11 am ET/5 pm CET 6 Design I section 2 Jan. 23–Feb. 29 T/TH 3:30 pm PT/6:30 pm ET 6 Design for Manufacturability Feb. 20–Mar. 7 T/TH 9 am PT/12 pm ET/6 pm CET 3 Course: BGA, BTC & PoP Packaging & Assembling – Processes, and Reliability Feb. 27–Mar. 14 T/TH 8 am PT/11 am ET/5 pm CET 3 Electronics Program Manager Feb. 27–Apr. 4 T/TH 2:30 pm PT/5:30 pm ET 6 Design II section 1 Mar. 18–May 15 M/W 8 am PT/11 am ET/5 pm CET 8 Advanced Design Concepts Mar. 18–May 15 M/W 3:30 pm PT/6:30 pm ET 8 Design II section 2 Mar. 19–May 16 T/TH 3:30 pm PT/6:30 pm ET 8 Design I (Brazil) Apr. 22–May 29 M/W 7 pm BST/ 6 pm ET 6 Lead-free Production Defects & Issues – Causes, Remedies & Prevention Apr. 23–May 2 T/TH 8 am PT/11 am ET/5 pm CET 2 Course: Counterfeit Electronic Parts Mitigation in Mission Critical & Life Saving Supply Chains Apr. 23–May 16 T/TH TBD 4 DFM: Is it Dead or Alive? May 6-8 M/W 3:30 pm PT/6:30 pm ET 1 Course: Gold-Aluminum Wire Bonding Chip Assembly Process, Quality and Reliability May 7-16 T/TH 8 am PT/11 am ET/5 pm CET 2 Course: Technology May 7-30 T/TH 8 am PT/11 am ET/5 pm CET 4 Design for Rigid Flex Boards June 3–July 10 M/W 3:30 pm PT/6:30 pm ET 6 Design I June 3–July 10 M/W 3:30 pm PT/6:30 pm ET 6 Troubleshooting & Defect Analysis June 4–June 27 T/TH 8 am PT/11 am ET/5 pm CET 4