Issue link: https://iconnect007.uberflip.com/i/1513827
50 SMT007 MAGAZINE I JANUARY 2024 used to verify the capability of the jetting pro- cess. Figure 11 and Figure 12 show the process capability report for X and Y positioning. e positioning in the X axis gives a process capa- bility of ± 18.8 μm at 3-sigma and in the Y axis of ± 16.5 μm at 3-sigma. e process capability report for the dot diameter is shown in Figure 13. e average dot diameter is 294.4 μm and its process variability is ± 6.2% at 3-sigma. Figure 14 shows the BGA pads aer the jet- ting process. A complete image of the prod- uct is not allowed due to nondisclosure agree- ments. In this case, there is no comparison between a manual or semiautomatic process because the customer used the fully automatic solution from the beginning. Discussion e customer used to replace the TQFP component manually, which means that aer removing the component, the solder paste was applied through a stencil and the pick and place was performed using semiautomatic equipment. Due to the high automation and flexibility of the proposed method, throughput improvements of 500% have been reported. Desoldering the component and perform- ing X-ray and visual inspections remain in the bottlenecks of the repair. e solder dots used Figure 11: Distribution of the X positioning of the BGA component. Figure 13: Dot diameter distribution of the BGA component. Figure 12: Distribution of the Y positioning of the BGA component. Figure 14: BGA component after jetting.