72 SMT007 MAGAZINE I JANUARY 2024
Koh Young's Harald Eppinger talks about the company's
technology for the semiconductor and advanced
packaging market and how they address the challenges
introduced by reflective components and micro solder
deposits.
It was a pleasure to attend SMTA Silicon
Valley on Thursday, Dec. 7 at the Flex
campus. The show hosted just over 60
exhibitors, which meant the narrow aisles
remained full of attendees throughout the day.
Friday, Nov.
17 brought us
to the venue
for the world
finals of the
IPC Hand Sol-
dering Com-
petition. After many regional competitions,
the finalists gathered in Munich to compete
against one another to gain the title of
world champion.
Real Time with... productronica 2023:
Koh Young Discusses Semiconductor
and Advanced Packaging Inspection
Ringing in Some Holiday Cheer
at SMTA Silicon Valley
The Finer Points:
World Champions of the
IPC Hand-Soldering Finals
TOP TEN
EDITOR'S
PICKS
SpectorBOX X1 can be used bottom-up for
volume measurement of THT solder joints
and pin height measurement, or top-down
for a 150 mm + clearance for 3D THT
components measurement, making it the
first compact 3D AOI system for precision
inspecting of THT solder joints and
components.
Mek Launches the SpectorBOX X1: A Revolution in 3D THT Inspection
