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10 SMT007 MAGAZINE I APRIL 2024 In this installment of my artificial intelli- gence (AI) series, I will touch on the key foun- dational technologies that propel and drive the development and deployment of AI, with spe- cial consideration of electronics packaging and assembly. e objectives of the series: • Build and stay in the knowledge zone • Spur innovative ideas and inspire new vistas for new opportunities • Highlight what it takes to achieve AI with justified confidence and trust • Achieve a balance between AI's omnipotent power and its potential downsides • Leverage AI as a virtual tool to facilitate an individual's job efficiency and effective- ness and future job prospects, as well as the enterprise business growth Breakthroughs and Transformational Technologies Since the discovery of the electron in 1897 by Joseph John omson, striking breakthroughs of the 20th and 21st centuries include: • Invention of the transistor in 1947 • Introduction of the microprocessor in 1972 • Official birth of the internet in 1983 • Internet-enabled hardware and applications during the decade of 1990s • AI development in the decade of 2010s • Introduction of AI ChatGPT-4 by OpenAI in 2023 Based on these breakthrough technologies, many products and services have been devel- oped that improve the quality of human life and spur global prosperity—and it all came from the discovery of that tiny unit called an electron. AI Opportunities, Challenges, and Possibilities, Part 1 SMT Perspectives and Prospects by Dr. Jennie S. Hwang, CEO, H-TECHNOLOGIES GROUP