Issue link: https://iconnect007.uberflip.com/i/1518339
112 SMT007 MAGAZINE I APRIL 2024 Process Control by Chris Hunt and Graham K. Naisbitt, GEN3 In this book, the authors examine the role of SEC test and how it is used in maintaining process control and support for objective evidence (OE.) Issues, including solution choices, solution sensitivities, and test duration are explored. The Companion Guide to... SMT Inspection: Today, Tomorrow, and Beyond Advances in artificial intelligence have been limited exclusively to the human world until now, but there are far-reaching applications within the manufacturing sector, too. In this guide book, learn how equipment providers like Koh Young are enabling the Smart Factory of the Future by adopting AI to generate "knowledge" from "experience." Solder Defects by Christopher Nash and Dr. Ronald C. Lasky, Indium Corporation This book is specifically dedicated to educating the printed circuit board assembly sector and serves as a valuable resource for people seeking the most relevant information available. New! Encapsulating Sustainability for Electronics This is a guide to encapsulation resins and their use in ruggedizing electronics. Learn about aspects such as their chemistry, application, and relevant test methods in different industries. The book also discusses the growing demand for sustainable solutions in the market and highlights examples of bio-based resins and the demand from emerging technologies. PODCAST! Designing for Reality with ASC Sunstone In Season 2, listeners can expect in-depth conversations with VP/manager and published author Matt Stevenson about the specifics that can affect your circuit board during the manufacturing process. Part tutorial, part tips and tricks, Stevenson details the interrelationships between design, fabrication, yields and cost optimization. Our library is open 24/7/365. Visit us at: I-007eBooks.com Smarter Manufacturing Enabled with Inspection Data with expert Ivan Aduna In this 12-part webinar series, viewers will learn about secure data collection, AI-powered solutions to manage and analyze data, and how to leverage the IPC CFX-QPL to succeed in the transformation to Industry 4.0.