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SMT007-Apr2024

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98 SMT007 MAGAZINE I APRIL 2024 de-facto decentralized and globally accessible. Cloud tools are considered central to improv- ing communication, implementing sustain- able development processes, mitigating poten- tial supply chain risks, and adopting agile prac- tices that lead to robust manufacturing capabil- ity that can bridge gaps in a globally disparate production environment. We note that design processes have already successfully launched into the cloud and are available to designers from a wide range of service providers. We propose that the next logical step of cloud adoption will be DFM analysis, bringing the verification of designs into the cloud as well. We expect that a num- ber of companies will vie for position in this emerging market, in a similar manner to what is already taking place in the cloud-based EDA market. Furthermore, we propose that new markets will evolve for services in the cloud, to meet the needs of PCB design and manufacturing at each step of the new product introduction workflow. We predict that the rising impor- tance of small-to-medium businesses (SMBs) in the electronics industry will increase demand for and drive provision of affordable solu- tions in the cloud for all PCB lifecycle events. is emerging market deserves the attention of all current soware and service provid- ers as it may disrupt and displace the legacy, on-premises, monolithic approach to PCB design, verification, manufacturing, assembly, and testing. SMT007 References 1. "cyLEDGE Configurator Database," cyLEDGE, accessed Sept. 18, 2022. 2. "Customers Want Customization, and Compa- nies Are Giving It to Them," by A. Freudmann, New York Times, March 18, 2020. 3. "Digital Factories 2020: Shaping the future of manufacturing," by R. Geissbauer, S. Schrauf, P. Berttram and F. Cheraghi, PricewaterhouseCoopers GmbH, 2017. 4. "Report: The 20 industries most concerned about supply chain issues in 2022," by M. Ransom, Avnet Silica, 2022. 5. "Second Wave of Supply Chain Woes Looms," by G. Hilson, EE Times, Dec. 12, 2021. 6. "Trade in Counterfeit ICT Goods," OECD Pub- lishing, Paris, 2017. 7. The National Bureau of Asian Research, "Update to the IP Commission Report," The National Bureau of Asian Research on behalf of The Commission on the Theft of American Intellectual Property, 2017. 8. "The Worldwide Electronic Manufacturing Ser- vices Industry is Projected to Grow at a CAGR of 8.64% Between 2020 and 2025," Research and Markets, Globe Newswire, 23 October 2020. 9. Business Standard, "Revenue outlook bright for electronics SMEs: Crisil SME Tracker," 27 May 2022. [Online]. [Accessed 19 September 2022]. 10. "The Cloud in 2021: Adoption Continues," by M. Loukides, O'Reilly Media Inc., 2021. 11. "Cost of moving to the cloud drops with time and experience," by R. Gareiss, Tech Target, April 17, 2020. Additional Sources • A. Freudmann, "Customers Want Customization, and Companies Are Giving It to Them," New York Times, 18 March 2020. [Online]. [Accessed 6 September 2022]. • Fortune Business Insights, "Electronic Manufac- turing Services (EMS) Market Size, Share and COVID-19 Impact Analysis, By Service, By Indus- try, and Regional Forecast, 2022-2029," March 2022. [Online]. [Accessed 6 September 2022]. • The World Bank, "Small and Medium Enterprises (SMEs) Finance," [Online]. [Accessed 19 Septem- ber 2022]. • "The performance of Small and Medium Sized Businesses in a digital world," Deloitte Financial Advisory, S.L.U., 2019. • "MFTPaaS Market Segmentation by Type and by End-User—Global Demand Analysis and Oppor- tunity Outlook 2031.," Research Nester, 22 July 2022. [Online]. [Accessed 6 September 2022]. • Gartner Inc., "Gartner Forecasts Worldwide Pub- lic Cloud End-User Spending to Reach Nearly $500 Billion in 2022," Gartner Inc., 19 April 2022. [Online]. [Accessed 6 September 2022]. • Flexera, "Flexera 2022 State of the Cloud Report," Flexera, 2022. • Forrester, "State Of Public Cloud Migration, 2022," Forrester, 2022. Related Content: "Sustainability Through Cloud Applications," On the Line with... Siemens, Season 1, Episode 2.

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