SMT007 Magazine

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• SMT007 Magazine — April 2024
• Featured Content — Box Build
• Additional Content
• Column — Do More, Get More
• Short — A Battery's Hopping Ions Remember Where They've Been
• Column — AI Opportunities, Challenges, and Possibilities, Part 1
• Feature Interview — Thinking Inside the Box for a Change
• Feature Column — A CM's Perspective on Box-build Practices
• Short — Researchers Capture Strange Behavior of Laser-excited Gold
• Feature Interview — Determining the Value-add of Box Build
• Real Time With…Special Section: Top 5 Things you need to know about
• Blackfox Training: Manufacturing Training
• Burkle North America and Schmoll: Drilling Automation Solutions
• LPKF: Laser Depaneling
• KYZEN: Cleaning
• Mycronic: Placement
• Technica, U.S.A.: Implementing Smart Automation Solutions
• Feature Interview — The Connection Between Wire Harness and Box Build
• Article — ADCO Circuits Case Study: From Inspection Skeptic to Innovation Enthusiast
• MilAero007 Highlights
• Excerpt: Analysis of Pull Force Test Results for Crimped Connections
• Short — T-Global Technology Offers Solutions for Thermal Management Challenges
• Excerpt: The Brave New World of PCB Design Validation—Cloud-based DFM and Collaboration
• Top Ten Editor's Picks
• Career Opportunities
• Educational Resources
• Advertiser Index and Masthead
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