Design007 Magazine

Design007-July2024

Issue link: https://iconnect007.uberflip.com/i/1523825

Contents of this Issue

Navigation

Page 72 of 91

IPC invites engineers, researchers, academics, students, technical experts, and industry leaders to submit abstracts for IPC APEX EXPO 2025. CALL FOR PARTICIPATION TECHNICAL TOPICS / / ADVANCED PACKAGING/COMPONENTS / ASSEMBLY & TEST PROCESSES / DESIGN / ELECTRONIC ASSEMBLY MATERIALS / EMERGING TECHNOLOGIES / FACTORY OF THE FUTURE / HDI, μHDI AND SUBSTRATES / PCB FABRICATION AND MATERIALS / POWER ELECTRONICS / QUALITY & RELIABILITY / SUSTAINABILITY FOR ELECTRONICS Technical Conference Abstracts and Professional Development Course Abstracts Due September 6, 2024. Conference Poster Abstracts Due October 4, 2024. IPCAPEXEXPO.ORG \ #IPCAPEXEXPO

Articles in this issue

Links on this page

Archives of this issue

view archives of Design007 Magazine - Design007-July2024