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Design007-July2024

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JULY 2024 I DESIGN007 MAGAZINE 81 When a transmission line is perfectly matched to the driver and load, the signals propagating electromagnetic (EM) energy are totally absorbed by the load. This is the perfect scenario that all electronics designers strive for. However, this is rarely the case, and reflections do occur when- ever the impedance of the transmission line changes along its length. Mismatched impedance causes signals to reflect back and forth along the lines, which causes ringing at the load. The U.S. North- east's annual PCB design and manu- facturing show went on hiatus years ago as sister show PCB West continued to expand in Silicon Valley. But PCB East relaunched a few years ago, and it's been growing each year. Attendance was double from 2022. I-Connect007 is happy to announce the release of the latest episode in Series 3 of On the Line With..., now available here and on Apple and Spotify. In "PCB 3.0: A New Design Methodology— Data Management," product engineering expert Mark Hepburn joins the podcast to discuss the value of collaboration in the printed circuit board design and manufacturing cycle. During PCB East, I caught up with our friend Scott Miller of Freedom CAD. Scott has been chief operat- ing officer of the company for quite a while, but he recently assumed a new title as new, younger managers moved up into top leadership posi- tions. I asked Scott to discuss his new role, as well as the company's move to keep looking at the industry in novel, fresh ways. The future of the PCB industry will be based on technology. As components get smaller, denser, and more complicated, PCB fabrication companies must keep up with their cus- tomers' needs both today and in the future. It is no longer enough to just keep up with our customers' current needs. We must be prepared to meet their PCB needs three to five years out. When designing for manu- facturability, understanding the lamination process can prevent many headaches and costly delays. Lamination is a required step in the manufac- ture of multilayer boards, and preparing for this step requires a basic understanding of the materials and processes used. So far, this column has covered everything from CAD tools to CAM preparation. For the latest news and information, visit PCBDesign007.com Collaboration and Data Management the Focus of Latest Podcast From Cadence and I-Connect007 PCB East Keeps Getting Bigger Beyond Design: Termination Planning Connect the Dots: Designing for Reality—Lamination and Materials Freedom CAD Ready for Future With New Leadership Standard of Excellence: Looking Five Years Into the Future Anaya Vardya

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