Issue link: https://iconnect007.uberflip.com/i/1526407
8 DESIGN007 MAGAZINE I SEPTEMBER 2024 Are the walls really coming down? Traditionally, most designers of PCBs and ICs have operated in separate silos, unaware of much of what's happening upstream or down- stream. IC designers did their thing, and PCB designers did theirs, and everything worked. Until recently, that is. Now, the increase in complexity in electron- ics is driving technologists throughout the electronics supply chain to adopt a "silicon to systems" outlook. Advanced packaging sys- tems are causing PCB designers problems with signal integrity and power delivery require- ments, as well as thermal issues. Sub-nanosec- ond edge rates in ICs are wreaking havoc with signal integrity engineers at the board level. Now, designers need to know it all, from "soup to nuts." As we learn in this issue, IPC introduced the term "silicon to systems" in 2021 as a handy way to sum up the magnitude of the challenges facing the domestic elec- tronics manufacturing segment in the U.S. As IPC CTO Matt Kelly, who coined the term, explains, "Everything follows silicon." What does all this mean to PCB designers? is month, we asked our expert contribu- The Shaughnessy Report by Andy Shaughnessy, I-CONNECT007 Silicon to Systems: The Walls Are Coming Down