Issue link: https://iconnect007.uberflip.com/i/1526407
16 DESIGN007 MAGAZINE I SEPTEMBER 2024 and you will still see increased thermal issues in that area. How do you dissipate that? How do you get that down into the board? In my advanced con- cepts class, we talk about having to use increas- ingly thinner coppers as we get into HDI, and how we can no longer rely on even the copper pours to be as good at dissipating the thermal power out of those chips. How do you dissipate that? How do you make sure you have enough thermal conductivity path out of those devices and into the board and so on? How do we use enough vias? How do we use plane stitching and all those kinds of effects? In my military class, we get into the vibration shock, altitude effects with Paschen's Curves and low air density and arc- over events happening, even at low voltages. We get into the high level of radiation effects on sili- con. We cover all of those in my various classes. Matt, what needs to happen for the industry to embrace silicon to systems? What would you like to see happen in the community and the industry? Kelly: I think the biggest thing is feedback from the OEMs and users. Knowing what those needs are really defines everything. Devan and Kris have been talking in-depth about all the technical elements. Everything starts with design. We need to get that feedback from dif- ferent segments and understand what they really need within next-generation products. Iyer: It's feedback about customization vs. stan- dardization. If you were to get some feedback from your readers, I imagine that there would be a general tendency to get more customized products, because of the integration that's hap- pening: "Let's do integration and get the prod- uct out." But there's too much customization in the pipeline, and that goes against standardiza- tion. e more we give importance to custom- ization, the more scalability goes down. In manufacturing, you prefer to have stan- dardized products so that you get maximum volume out, increase your productivity and manufacturing efficiency to bring your costs down. e more you have customized prod- ucts, the more your manufacturing scalability is affected. We need to have a balance between customization and standardization. What is that sweet spot? How do we define that sweet spot? I will add one more factor to it: Innova- tion versus a robust supply chain to support the innovation in manufacturing. Great inno- vations lead to fantastic products, but we need to have the right supply chain to give us the materials and processes at the right cost. Moyer: To that I'll add that once we have that feedback, we need to have a conversation about the challenges to system-level design. Many times I've been talking to a fabricator and not even thinking about power density. We had two worlds—the front end and back end. It was distinct and big, and there were a lot of disciplines that were unique to each. But now with miniaturization, those two popula- tions are getting closer. at's why you hear people saying the lines are blurring. Thanks for the great information, gentlemen. Kelly: ank you, Andy. DESIGN007 Kris Moyer