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Design007-Sep2024

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20 DESIGN007 MAGAZINE I SEPTEMBER 2024 tributions include developing the IC package design course for training and updating the PCB design and IC design courses. I am fortunate to have been given numerous opportunities to upskill myself and be intro- duced to IPC design certifications. I owe a huge thank you to Tan Beng Teong. I am also grateful to my IPC mentors Dieter Bergman and Gary Ferrari for their guidance, patience, and generosity in the learning process that has inspired me to continue to update and guide new learners in the industry through IPC. What sort of education do you have? My formal engineering education includes a diploma in electronics engineering (Ngee Ann Polytechnic, Singapore), BEng (Hons, Elec- tronic System Engineering) at the University of Essex (UK), and MSc (E&E Microelectron- ics) at the National University of Singapore. We're seeing more technologists pointing out the need for PCB designers to focus on silicon to systems integration. What does that term mean to you? Silicon to systems is about the levels of packag- ing and a focus on the end-product (system), which could be any of these: automotive, com- puter and business equipment, communica- tion, consumer, industrial and medical, mili- tary, and aerospace. It also describes the awareness of the ecosys- tem or supply chain delivering the system. e aermath of COVID-19, current geopolitical tensions, and intense market competition for high-technology products prompted top gov- ernment agencies to re-evaluate the availabil- ity of raw materials and outsource critical facil- ities outside their vicinities. In other words, these agencies are focused on producing a self- reliant advanced product or system. Another perspective would come from the collaborative effort needed to implement a complete flow in the co-design and produc- tion of IC to package to board to system. It is ideally represented by a seamless flow and trans- fer of data taking place. A multi-disciplinary platform would require an integration of CAD, analysis tools, digitalization, and automation. What are the most important things that PCB designers need to understand about silicon and packages? It is recommended that PCB designers know how to differentiate between silicon and other semiconductor technologies, such as GaAs (gallium arsenide) and SiC (silicon carbide), since their applications are specific to the end- products. is includes understanding the accompanying IC package's characteristics and limitations. is ensures a suitable pack- age type is selected for the intended reliabil- ity and environment at the system level. is information is also very useful for designing ATE (automated test equipment) PCBs for the back-end process of the IC chip, before deliv- ery to customers. An understanding of this type of board design would be in high demand for the U.S. or EU when the back-end chip testing facilities return. Semiconductor and packaging knowledge is also highly anticipated for future PCB design- ers who work in a team co-design platform comprising IC, package, and PCB designers. e PCB designers could consider bridging Soo Lan Cheah

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