Issue link: https://iconnect007.uberflip.com/i/1526407
32 DESIGN007 MAGAZINE I SEPTEMBER 2024 that support seamless design flows from the chip level up to the complete system. is approach ensures that all components work together efficiently, reduces design iterations, and improves time-to-market by addressing potential integration issues early in the design process. What do PCB designers need to understand about silicon and packages? PCB designers must under- stand the following aspects of silicon and packages: • Signal integrity and power integrity: As signals travel from silicon through the package to the PCB, maintaining signal quality and managing power distribution is critical. PCB designers must account for high-speed signal requirements, imped- ance control, and proper power delivery network design to avoid noise in regard to crosstalk, EMI, and EMC. • ermal management: Higher integra- tion and power densities in silicon and packages lead to heat generation. Design- ers must incorporate effective thermal management solutions, such as heat sinks, thermal vias, and appropriate material choices. • Land patterns and layout considerations: Understanding the physical and electri- cal requirements of IC packages is cru- cial. is includes correct pin mapping, accommodating different package types (e.g., BGA, LGA, microBGAs, QFP, etc.), and ensuring sufficient spacing and layer stackup to include the necessary via tech- nologies to support the chip's needs. • Design for manufacturing: Awareness of the manufacturing processes for both silicon and PCB can help designers cre- ate designs that are easier to manufacture, test, and assemble, reducing costs and time. Close collaboration with your external suppliers is key to success. As silicon continues to shrink and Moore's law runs out of steam at the packag- ing level, how will this affect PCB designers and design engineers? As silicon scaling becomes more challenging and Moore's law slows down, the role of packaging becomes increasingly critical. is shi will affect PCB designers and design engi- neers in several ways: Increased complexity: Advanced packaging technologies, like 2.5D and 3D integration, require designers to manage more complex interconnects, more challenging power deliv- ery requirements, and thermal issues. is complexity requires sophisticated design tools and a deep understanding of multi-die packag- ing with heterogeneous integration. Greater emphasis on co-design: PCB design- ers must work more closely with IC and package designers/teams to ensure that the chip-pack- age-board integration is co-optimized, com- monly called "system technology co-optimiza- tion" or STCO. is collaboration might involve shared design environments or tighter integra- tion of design tools across different domains. New materials and techniques: As traditional methods hit their limits, PCB designers must become familiar with new materials (e.g., low- loss dielectrics) and advanced manufacturing techniques to support high-density and high- speed requirements. There is a convergence of PCB and IC design, with each discipline having a solid understanding of the other. Are we approaching this convergence soon? Stephen Chavez