Design007 Magazine

Design007-Sep2024

Issue link: https://iconnect007.uberflip.com/i/1526407

Contents of this Issue

Navigation

Page 4 of 75

SIGNIFICANTLY IMPROVE SOLDER BALL/JOINT AND SHOCK-DROP RELIABILITY Offers excellent adhesion and mechanical strength to most SMDs Integrates seamlessly with existing SMT lines and tape and reel feeders Tested with lead-free solders and lead-free assembly processes No additional equipment or secondary processes are needed 100% reworkable Long shelf life PLACE-N-BOND™ UNDERFILMS 1-847-394-5800 | alltemated.com Underfilm Underfill

Articles in this issue

Links on this page

Archives of this issue

view archives of Design007 Magazine - Design007-Sep2024