54 DESIGN007 MAGAZINE I OCTOBER 2024
In the previous episode of I-Connect007's
On the Line with… podcast, we painted the pic-
ture of the outer layer imaging process. Now
we are ready for pattern plating, where fabri-
cation can get tricky. e board is now ready
to receive the copper traces, pads, and other
elements specified in the original CAD design.
is article will lay out the pattern plating pro-
cess and discuss constraints in the chemistries
that must be properly managed to meet the
customer's exacting manufacturing tolerances.
Breaking Down the Pattern
Plating Process
We start with a pattern: e circuit board
design is created with a photoresist mask
exposing all the traces and pads to the cop-
per foil or plated copper below it. e next
step is plating copper on top of the pattern.
is builds copper thickness inside the holes,
on the surface, along the traces, and on the
pads.
Designing for Reality:
Pattern Plating
Connect the Dots
by Matt Stevenson, ASC SUNSTONE CIRCUITS
