PCB007 Magazine
PCB007-Nov2024
Issue link:
https://iconnect007.uberflip.com/i/1529411
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Articles in this issue
PCB007 Magazine — November 2024
Featured Content — Engineering Economics
Additional Content
Column — Engineering Economics
Short — Breakthrough in Semiconductor Patterning: New Block Copolymer Achieves 7.6 nm Line Width
Article — IPC Hall of Fame Spotlight Series: Highlighting Patty Goldman
Feature Interview — Designing for Cost to Manufacture
Feature Article — Process Yield Statistics and Distributions
Feature Column — Make the Investment Where It Realy Counts
Column — Getting the Best from Your Cupric Chloride Etchant
Short — Purdue University Leads Research on Autonomous Transportation Network
Feature Article — Calculating PCB Complexity and First-pass Yields
MilAero007 Highlights
Column — The Administration Changed, but Our Industry's Needs Remain
Short — New Technique Could Unlock Potential of Quantum Materials
Interview — Has the Time Finally Come for Tin-nickel Plating?
Feature Article — Case Study: PCB Design Flaws Affect Product Cost
Feature Article — Break-even Time (BET)
Column — The Benefits of Continuing Education
Feature Article — Understanding Depreciation for Electronics Manufacturing
Article — Does China Plus One Actually Work?
Feature Column — Yields March to Design Rules
Short — AI-Trained Vehicles Can Adjust to Extreme Turbulence on the Fly
Top Ten Editor's Picks
Career Opportunities
Educational Resources
Advertiser Index & Masthead
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