PCB007 Magazine

P O D C A S T S E R I E S PCB 3.0: A New Design Methodology with Team Cadence with Team Siemens Sustainability Designing for Reality with Matt Stevenson ASC Sunstone with Julie Cliche-Dubois Cogiscan BONUS COMPANION GUIDE! BONUS COMPANION GUIDE!

• PCB007 Magazine — November 2024
• Featured Content — Engineering Economics
• Additional Content
• Column — Engineering Economics
• Short — Breakthrough in Semiconductor Patterning: New Block Copolymer Achieves 7.6 nm Line Width
• Article — IPC Hall of Fame Spotlight Series: Highlighting Patty Goldman
• Feature Interview — Designing for Cost to Manufacture
• Feature Article — Process Yield Statistics and Distributions
• Feature Column — Make the Investment Where It Realy Counts
• Column — Getting the Best from Your Cupric Chloride Etchant
• Short — Purdue University Leads Research on Autonomous Transportation Network
• Feature Article — Calculating PCB Complexity and First-pass Yields
• MilAero007 Highlights
• Column — The Administration Changed, but Our Industry's Needs Remain
• Short — New Technique Could Unlock Potential of Quantum Materials
• Interview — Has the Time Finally Come for Tin-nickel Plating?
• Feature Article — Case Study: PCB Design Flaws Affect Product Cost
• Feature Article — Break-even Time (BET)
• Column — The Benefits of Continuing Education
• Feature Article — Understanding Depreciation for Electronics Manufacturing
• Article — Does China Plus One Actually Work?
• Feature Column — Yields March to Design Rules
• Short — AI-Trained Vehicles Can Adjust to Extreme Turbulence on the Fly
• Top Ten Editor's Picks
• Career Opportunities
• Educational Resources
• Advertiser Index & Masthead