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PCB007-Nov2024

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64 PCB007 MAGAZINE I NOVEMBER 2024 Engineers kept finding assemblies that showed the flaw at various levels throughout the test- ing phases, and finally identified the root cause during final test. ey discovered that the designer had overlooked critical routing on a very sensitive portion of the design. at cre- ated issues with the clean transfer of the sig- nal and created isolated overheating. is led to delamination and jeopardized the satellite's mission objectives. As a direct consequence of the flaw, Aero- Tech faced several challenges: • Production delays: e discovery of the design flaw required a respin of the design, delaying the timeline for the satellite's completion by several months. • Increased costs: e unplanned design rework led to significant unplanned expen- ditures, including not only the cost of redesigning the circuit board, but also extended labor and resource allocation. • Reputation risks: Prolonged delays risked damaging AeroTech's reputation in the highly competitive aerospace sector, where reliability and timely delivery are crucial. Corrective Action To address the PCB flaw effectively, Aero- Tech Solutions engaged closely with its PCB manufacturer, American Standard Circuits (ASC). e collaboration was essential to expedite a resolution and minimize financial repercussions. ese included: 1. Immediate assessment and communi- cation with the PCB fabricator: Upon identifying the flaw, AeroTech promptly contacted ASC for an assessment. Both teams facilitated a transparent dialogue to understand the complexity of the issue and identify corrective actions. 2. Design revision: Engineers from Aero- Tech worked hand-in-hand with ASC's engineers to create a revised PCB layout. Utilizing advanced simulation tools, they ensured that the new design addressed the preceding errors, reinforcing durability and efficiency. 3. Prototyping the solution: Once the design adjustments were made, ASC rapidly produced a prototype of the new PCB. is allowed AeroTech to conduct

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