Issue link: https://iconnect007.uberflip.com/i/1531384
• Flexible and rigid-flex PCBs: Wearable devices, IoT gadgets, and automotive applications require flexible form factors. › Use of flexible substrates like polyimide › Increasing adoption of hybrid rigid-flex designs for improved durability and adaptability • Integration of 3D printing in PCB manufacturing: 3D printing allows for rapid prototyping and manufacturing of complex, multilayer PCB designs. › Additive manufacturing for custom geometries › Embedding components directly into the PCB during the printing process • Increasing focus on signal integrity and power integrity: As clock speeds increase and designs become more com- plex, managing signal and power integrity becomes crucial. › Advanced simulation tools for pre-layout analysis › Design techniques to minimize electro- magnetic interference (EMI) and crosstalk › Power distribution network (PDN) optimization • PCB design automation and AI integration: To reduce design time and improve accuracy. › Enhance individual and team productivity › AI-driven tools for automated component placement, routing, and error detection › Machine learning algorithms for opti- mizing complex designs • High-frequency and high-speed designs: Technologies like 5G, IoT, and autono- mous vehicles require PCBs capable of handling high-speed signals. › Designs optimized for GHz-range frequencies › Impedance-controlled traces and high-speed routing techniques • Cloud-based collaboration: Design teams are already taking advantage of cloud plat- forms and advanced EDA tools to share layouts, simulations, and feedback in real time, fostering global collaboration as a best practice. › Supply chain resilience is where we will see a significant impact with cloud-based collaboration. is will be even more the case in the future due to ongoing geo- political issues, part/material shortages, and onshoring. › Supply chain intelligence at the point of design regarding component selection is already key. JANUARY 2025 I DESIGN007 MAGAZINE 25