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PCB007-Jan2025

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JANUARY 2025 I PCB007 MAGAZINE 77 Happy Holden has worked in printed circuit technolo- gy since 1970 with Hewlett- Packard, NanYa Westwood, Merix, Foxconn, and Gentex. He is currently a contributing technical editor with I-Connect007, and the author of Automa- tion and Advanced Procedures in PCB Fabrication, and 24 Essential Skills for Engineers. To read past columns, click here. Figure 2: Ventec's new RCC properties and the graph of some of these materials as a function of dielectric loss vs. Z-axis CTE. (Source: SMTA UHDI Symposium & SMTAI Pavilion) Summary e need for UHDI programs is great. I saw this need at the IPC High Density PWB Con- ference at IPC APEX EXPO 2024, and SMTA's UHDI Pavilion last October. e next step is to tie our HDI and UHDI manufacturing pro- cesses to the new IPC HDI design standards and IPC UHDI design standards. PCB007 References 1. The HDI Handbook, Chapter 5, "HDI Materials." 2. SMTA 2024 Technical Knowledge, UHDI Sympo- sium (April 2024) and UHDI Pavilion (October 2024) 3. "Happy's Tech Talk #29: Semi-flex FR-4s," by Happy Holden, PCB007 Magazine, May 2024.

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