Issue link: https://iconnect007.uberflip.com/i/1534120
22 DESIGN007 MAGAZINE I APRIL 2025 Feature Q&A by Andy Shaughnessy I-CONNECT007 For this issue on RF design, I reached out to Zachariah Peterson, founder of Northwest Engineering Solutions, an engineering design services company in Portland, Oregon. You can find some of Zach's RF design presenta- tions on YouTube; he does a great job breaking down these complex ideas for PCB designers who are new to the RF side of things. I asked Zach to discuss the challenges fac- ing RF designers, the relevant material con- siderations, and the layout tips and techniques that can help RF designers master this "black magic" technology. Andy Shaughnessy: What are the most common challenges facing designers and EEs in the RF space today, and how can they be overcome? Zachariah Peterson: e biggest challenge in today's RF design is miniaturization while operating at high frequencies. Many designs combine RF with a digital processor in a BGA package, making them mixed-signal rather than pure RF. Some RF ASICs also have BGA packaging, and together these components may demand HDI design. High-frequency designs that are being min- iaturized also face manufacturing challenges. Tips to Master the 'Black Magic' of RF Design