Issue link: https://iconnect007.uberflip.com/i/1534120
APRIL 2025 I DESIGN007 MAGAZINE 9 than designing a traditional circuit board—if you know what you're doing. In this issue, our experts discuss the con- stantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm. We start with an interview with Alun Morgan, who discusses RF materials and the impact that laminate choice can have on your design. Colum- nist Vern Solberg shares his thoughts on proper stackup design techniques for RF PCBs; the wrong stackup can wreak havoc on an RF board. Zachariah Peterson discusses the most com- mon challenges—and solutions—in RF design. Kirsten Zima delves into the issues of designing PCBs that feature multiple wireless technologies, such as GPS, Wi-Fi, and Bluetooth. Cherie Litson provides an overview of RF design engineering, including handy DFM tips. David Vye discusses RF design from an EDA tool company's viewpoint, and Brent Mayfield does a deep dive into the develop- ment of RF materials. We also have an article on the use of UDHI in agricultural settings by Anaya Vardya, a column by Matt Steven- son, and reviews of IPC APEX EXPO and the Design Town Hall. Trade show season is underway. I hope to see you at PCB East. See you next month! DESIGN007 Andy Shaughnessy is managing editor of Design007 Magazine. He has been covering PCB design for 23 years. To read past columns, click here. Innovating Design: IPC's Vision for the Future In this interview with Peter Tranitz, IPC senior director of technology solutions, he talks about the IPC-hosted European electronics design conference, featuring peer-reviewed content and global participation. REAL TIME WITH... IPC APEX EXPO 2025