Issue link: https://iconnect007.uberflip.com/i/1535414
16 PCB007 MAGAZINE I MAY 2025 Issue Root Cause Solution Delamination in PTFE PCBs Low surface energy, poor adhesion Plasma treatment, silane coupling, optimized lamination Solder mask peeling in HDI PCBs Inadequate microetching, over-brushing Adjusted microetching, plasma activation Via plating failure in hybrid PCBs Resin smear blocking plating Dual-stage desmearing, process validation Corrosion in gold-plated medical PCBs Organic residues, moisture ingress Ultrasonic cleaning, plasma pre-treatment, improved plating Table 2: Key takeaways from case study defects and field failures • Electrolytic microetching allows for chem- ical recycling Conclusion Proper surface preparation is critical for ensuring adhesion, plating reliability, and long- term performance in PCB manufacturing. e choice of surface treatment depends on the material type, PCB design, and application requirements. Failures in surface preparation can lead to serious defects, including delamina- tion, poor plating adhesion, and electrical fail- ures. By implementing precise process controls, monitoring cleaning effectiveness, and adopt- ing advanced techniques like plasma treatment and laser texturing, PCB manufacturers can sig- nificantly reduce defects and enhance reliabil- ity. As the industry shis towards high-perfor- mance, RF, and HDI PCBs, investing in opti- mized surface preparation techniques will be key to achieving consistent quality and long- term product success as well as increasing envi- ronmental sustainability opportunities. PCB007 Resources • IPC-6012D • Rogers Corporation Technical Report, 2023 • "Microetching Chemistry for PCB Fabrication," by S. Hwang, Journal of Electronics Manufac- turing (2012). • IEC 61189-5-3 Standard • Multek White Paper, 2021 • "Plasma Surface Activation in PCB Manufacturing," by J. Lau, IEEE Transactions on Electronics Packaging (2020). • DuPont Advanced Materials, 2022 • ASM International Report, 2023 sooner than we think. From an environmen- tal sustainability viewpoint, here is how each method breaks down. Least Environmentally Friendly Methods: • Black oxide treatment: Uses hazardous chemicals like sodium chlorite and gener- ates toxic waste • Chemical microetching: Produces copper- laden wastewater that requires treatment • Permanganate desmearing: Generates hazardous sludge that must be neutralized • Abrasive blasting: Creates airborne dust that requires filtration Eco-friendliest Alternatives: • Plasma treatment eliminates chemical waste • Alternative oxide treatments reduce toxicity