Issue link: https://iconnect007.uberflip.com/i/1535414
58 PCB007 MAGAZINE I MAY 2025 ment into the industry. We're working to draw the attention of policymakers to make sure all these different supply chain programs include electronics, but there is always more that needs to be done. Matties: What should we say to members to bet- ter help the industry and the association overall? Every time I speak on the topic or do an interview, I mention that the participation of members is critical to the success of advocacy because when we walk into a congressional office to discuss tariffs or taxes, they want to know, "How will this impact the businesses in my constituency?" e most persuasive examples are those that show how, for example, the bonus depreciation will enable you to buy new equipment, add this capability, or hire more employees. ose examples have to come from business owners and member leader- ship. at means participating in surveys like we had recently on our advocacy page on ipc. org and signing up for our action alerts. We've taken IPC members to Capitol Hill in January and February. We're planning another visit in early summer, and multiple visits throughout the year. When business leaders come to Washington and meet with their members of Congress, it is very impact- ful. We need more members to become involved, share their stories, and help these important business incentives become law for the good of the whole domestic electron- ics manufacturing industry. Matties: Thank you, Rich. ank you for the invitation. PCB007 As artificial intelligence (AI) continues to advance, re- searchers at POSTECH (Pohang University of Science and Technology) have identified a breakthrough that could make AI technologies faster and more efficient. Professor Seyoung Kim and Dr. Hyunjeong Kwak from the Departments of Materials Science & Engineering and Semi- conductor Engineering at POSTECH, in collaboration with Dr. Oki Gunawan from the IBM T.J. Watson Research Cen- ter, have become the first to uncover the hidden operating mechanisms of Electrochemical Random-Access Memory (ECRAM*1 ), a promising next-generation technology for AI. This groundbreaking study has been published in the presti- gious international journal, Nature Communications. As AI technologies advance, data processing demands have exponentially increased. Current computing sys- tems, however, separate data storage ('memory') from data processing ('proces- sors'), resulting in significant time and energy consump- tion due to data transfers between these units. To ad- dress this issue, researchers developed the concept of 'In-Memory Computing.' 'In-Memory Computing' enables calculations directly within memory, eliminating data movement and achiev- ing faster, more efficient op- erations. ECRAM is a critical 'Electron, Go Straight Ahead!' A Shortcut to AI Computation Discovered technology for implementing this concept. ECRAM devic- es store and process information using ionic movements, allowing for continuous analog-type data storage. How- ever, understanding their complex structure and high-re- sistive oxide materials has remained challenging, signifi- cantly hindering commercialization. To address this, the research team developed a multi- terminal structured ECRAM device using tungsten oxide and applied the 'Parallel Dipole Line Hall System'*2), en- abling observation of internal electron dynamics from ul- tra-low temperatures (-223°C, 50K) to room temperature (300K). They observed, for the first time, that oxygen va- cancies inside the ECRAM create shallow donor states (~0.1 eV), effectively forming 'shortcuts' through which electrons move freely. Rather than simply increasing electron quan- tity, the ECRAM inherently creates an environment facili- tating easier electron trans- port. Crucially, this mecha- nism remained stable even at extremely low tempera- tures, demonstrating the ro- bustness and durability of the ECRAM device. Commercializing this technology could lead to faster AI performance and extended battery life in de- vices such as smartphones, tablets, and laptops." (Source: POSTECH)