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18 PCB007 MAGAZINE I MAY 2025 Feature Q&A with Josh Krick and Tim Blair IEC In PCB manufacturing, understanding the intricacies of the photoresist process is cru- cial for achieving high-quality results. Industry experts Josh Krick, a technical service engineer at IEC, and Tim Blair, a PCB imaging special- ist at Tim Blair LLC, share their knowledge on the essential stages of photoresist application, highlight critical advancements in materials, and discuss common defects encountered dur- ing production. ey share best practices and innovative solutions to enhance the manufac- turing process, reduce defects, and ensure effi- ciency and reliability in high-tech applications. What are the most critical steps in the photo- resist process in PCB fabrication for ensuring high-quality results? Josh Krick: When focusing on the photoimag- ing process, we will always work our way from the ground up: surface preparation, lamina- tion, exposure, and then finish with develop- ing. Certainly, if deemed necessary, we can also focus on the additional processes of strip- ping the photoresist, etching, and even plating applications. Each one of these steps is just as crucial as the next. All these processes should have daily checks and protocols to ensure con- Key Insights on Photoresist for Defect Reduction